Allegro DRC 錯誤代碼
代码
单一字符代码
L
P
V
K
C
E
J
I
错误代码前置码说明
W
D
相关对象
Line
Pin
Via
Keep in/out
Component
Electrical Constraint T-Junction
Island Form
Wire
Design
说明
走线
元件脚
贯穿孔
允许区域/禁止区域
元件层级
电气约束
呈现T形的走线
被Pin或Via围成的负片孤铜
与走线相关的错误
与整个电路板相关的错误
M
错误代码后置码说明
S
N
W
双字符错误代
码
BB
BL
BS
CC
DF
Soldemask
Shape/Stub
Not Allowed
Width
Bondpad to Bondpad
Bondpad to Line
Bondpad to Shape
Package to Package
Symbol Soldermask to Symbol
Differential Pair Length Tolerance Differential Pair Primary Max Separation与防焊层相关的错误
与走线层的Shape或分支相关的错误
与不允许的设置相关的错误
与宽度相关的错误
Bondpad之间的错误
Bondpad与Line之间的错误
Bondpad与Shape 之间的错误
Package之间的 Spacing 错误 Soldermask零件防焊层之间的Spacing
错误
差分对走线的长度误差过长 差分对走线的主要距离太大
Differential Pair Secondary Max Separation Differential Pair Secondary Max Length
差分对走线的次要距离太大 差分对走线的次要距离长度过长
DI
Design Constraint Negative Plane Island 负片孤铜的错误
ED
Propagation-Delay Relative-Propagation-Delay
走线的长度错误 走线的等长错误
EL
Max Exposed Length
走线在外层（TOP&BOTTOM）的长度过
长
EP
Max Net Parallelism Length-Distance Pair
已超过Net之间的平行长度
ES
Max Stub Length
走线的分支过长
ET
Electrical Topology
走线连接方式的错误
EV
Max Via Count
已超过走线使用的VIA的最大数目
EX
Max Crosstalk Max Peak Crosstalk
已超过Crosstalk值 已超过Peak Crosstalk值
HH
Hold to Hold Spacing
钻孔之间的距离太近
HW
Diagonal Wire to Hold Spacing Hold to Orthogonal Wire Spacing
斜线与钻孔之间的距离太近 钻孔与垂直/水平线之间的距离太近
IM
Impedance Constraint
走线的阻抗值错误
JN
T Junction Not Allowed
走线呈T形的错误
Route Keepin to Bondpad
KB
Route keepout to Bondpad
Via Keepout
to Bondpad
KC
Package to Place Keepin Spacing
Package to Place Keepout Spacing KL
Line to Route Keepin Spacing
Line to Route Keepout Spacing KS
Shape to Route Keepin Spacing
Shape to Route Keepout Spacing BBVia to Route Keepin Spacing BBVia to Route Keepout Spacing BBVia to Via Keepout Spacing Test Via to Route Keepin Spacing
KV
Test Via to Route Keepout Spacing
Test Via to Via Keepout Spacing Through Via to Route Keepin Spacing Through Via to Route Keepout SpacingThrough Via to Via Keepout Spacing
LB
Min Self Crossing Loopback Length
LL
Line to Line Spacing
Bondpad在Keepin之外
Bondpad在keepout之内
Bondpad在Via Keepout之内
元件在Place Keepin之外
元件在Place Keepout之内 走线在Route Keepin之外
走线在Route Keepout之内 Shape在Route Keepin之外 Shape在Route Keepout之内 BBVia在Route Keepin之外 BBVia在Route Keepout之内 BBVia在Via Keepout之内 Test Via在Route Keepin之外 Test Via在Route Keepout之内 Test Via在Via Keepout之内 Through Via在Route Keepin之外 Through Via在Route Keepout之内Through Via在Via Keepout之内
无
走线之间太近
LS
Line to Shape Spacing
走线与Shape 太近
LW
Min Line Width Min Neck Width
走线的宽度太细 走线变细的宽度太细
MA
Soldermask Alignment Error
Pad
Pin/Via Soldermask to Symbol Soldermask
Soldermask Tolerance太小
MC
Pad与Symbol Soldermask之间的错误
MM
Pin/Via Soldermask to Pin/Via Soldermask
Pad
Soldermask之间的错误
PB
Pin to Bondpad
Line to SMD Pin Spacing
Pin与Bondpad之间的错误
走线与SMD元件脚太近 走线与Test元件脚太近
PL
Line to Test Pin Spacing
Line to Through Pin Spacing SMD Pin to SMD Pin Spacing SMD Pin to Test Pin Spacing
走线与Through元件脚太近 SMD元件脚与SMD元件脚太近 SMD元件脚与Test元件脚太近 Test元件脚与Test元件脚太近 Test元件脚与Through元件脚太近 Through元件脚与SMD元件脚太近 Through元件脚与Through元件脚太近
Shape与SMD元件脚太近 Shape与Test元件脚太近 Through元件脚与Shape太近
PP
Test Pin to Test Pin Spacing Test Pin to Through Pin Spacing Through Pin to SMD Pin Spacing Through Pin to Through Pin Spacing
Shape to SMD Pin Spacing
PS
Shape to Test Pin Spacing
Through Pin to Shape Spacing