RDA5991 DATASHEET
Package Thickness Volume mm3 Volume mm3
≥350 ＜2.5mm ≥2.5mm
240 + 0/-5 ℃ 225 + 0/-5 ℃
225 + 0/-5 ℃ 225 + 0/-5 ℃
Table 9-3 Pb-free Process – Package Classification Reflow Temperatures
Package Thickness
＜1.6mm 1.6mm – 2.5mm
≥2.5mm
Volume mm3 ＜350 260 + 0 ℃
*
Volume mm3 350-2000 Volume mm3 ＞2000
260 + 0 ℃ * 250 + 0 ℃ * 245 + 0 ℃ *
260 + 0 ℃245 + 0 ℃245 + 0 ℃
* * *
260 + 0 ℃ * 250 + 0 ℃ *
*Tolerance : The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature(this mean Peak reflow temperature + 0 ℃. For example 260+ 0 ℃ ) at the
rated MSL Level.
Note 1: All temperature refer topside of the package. Measured on the package body surface.
Note 2: The profiling tolerance is + 0 ℃, - X ℃ (based on machine variation capability)whatever is required to control the profile process but at no time will it exceed – 5 ℃. The producer assures process compatibility at the peak reflow profile temperatures defined in Table 9-3.
Note 3: Package volume excludes external terminals(balls, bumps, lands, leads) and/or non integral heat sinks.
Note 4: The maximum component temperature reached during reflow depends on package the thickness and volume. The use of convection reflow processes reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD package may sill exist.
Note 5: Components intended for use in a “lead-free” assembly process shall be evaluated using the “lead free” classification temperatures and profiles defined in Table9-1, 9-2, 9-3 whether or not lead free.
10. Change List
The following table summarizes revisions to this document.
REV
DATE
AUTHER
CHANGE DESCRIPTION
Miao Miao