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SPECIFCATION FOR APPROVAL
PART NO.
SPECIFCATION
NO.
PAGE 2 OF 2
DATE: 2011年09月15日
20D431K J
Tensile of Terminations Bending of Terminations Vibration Solderability
Resistance of soldering Heat
3. Mechanical Requirements 3.1 3.2 3.3 3.4 3.5
No Outstanding Damage No Outstanding Damage No Outstanding Damage Min.95% of The Terminal Should Be Covered With Solder Uniformly △ V1mA /V1mA ≤±5%
1Kgf, 10Sec 0.5Kgs,90 , 3Times Freq: 10-55hz Amp: 0.75 mm, 1Min Solder Temp:230±5℃ Immersed Time:2±0.5Sec Solder Temp:260±5℃ Immersed Time:10±1Sec
4．Environmental Requirements 4.1 4.2 4.3
High Temperature Storage Low Temperature Storage High Humidity Storage/Damp Heat
△ V1mA /V1mA ≤±5% △ V1mA /V1mA ≤±5% △ V1mA /V1mA ≤±5%
Ambient Temp:125±2℃ Duration: 1000h
Ambient Temp:-40±2℃ Duration: 1000h
Ambient Temp:40±2℃
90-95%R.H. Duration: 1000h Step
Temperature
-40℃ Room Temp 125℃ Room Temp
Period 30min 15min 30min 15min
1 2 3 4
4.4 Temperature Cycle
△ V1mA/V1mA ≤±5%
4.5 High Temperature Load
△ V1mA/V1mA ≤±10% △ V1mA/V1mA ≤±10%
Ambient Temp:85±2℃
Duration:1000h Load：Max Allowable Voltage
Ambient Temp:125±2℃
Duration:1000h Load：Max Allowable Voltage -40℃～+85℃ -40℃～+125℃
4.6 4.7 4.8
High Humidity load
Operating Temperature Range -40℃～+85℃ Storage Temperature Range
-40℃～+125℃