PCB DESIGEN : Hatched vs Solid pour的使用
本人从事多年的电子设计，也做过N多的PCB设计，一直以为铺地，没有什么区别，用HATCHED来做的。现在看了老外的文档后才知道，原来这个区别，在对于射频的设计，也要是很关键的，所以拿出来供国内的一些爱好者共享。记得在07年的时候，我用SOLID POUR做了一回，被印制板厂打了回来，说做不了，后来才明白是因为软件没有升级，于是给的GERBER文件，才能加工。现在多数的印制板厂家都可以进行SOLID POUR了。实在不行给GERBER文件也没有问题。 I still can not understand them,soseach some results from foreign webside. wo. Maybe inland, some arts and crafts can not come true. all tears.
In the case of the low speed boards you can use both of them. Actually, the Hatched pour is used in an analog and low current parts of board. In the HS board the Solid pour is used. It is so because at low speed the current choose the way with low RESISTANCE and at HS - with low INDUCTANCE (scin-effect), and brakes in the plane are not good for HS.
I also found a reference which gives all the physics behind why to use solid pours for high frequency boards, and the contrast against hatched. Cool! http://www.emchome.net/article.php/3095
Be careful with this terminology.
A hatched polygon or pour can also be the same as an electrically solid one depending on which package you use.
Hatched polygons can have a track fill width of say 0.2mm but have a distance of 0.1mm so will act as a solid.
Some packages allow for copper pours or solid regions, but in this case the only things drawn on the screen are the polygon outline and thermals and no copper actually exists until output.
These approaches can have an effect of increased user performance.
sometime salso we need to care about plotter on PCB FAB, some can not plot solid region, so thy the suggestion is to plase hatched lines very closely to fill area,
BUT, for AD6.7 users: you will have problem in this case, the tool became very slow and also will give you bug message or internall error message in each 10 minutes!
http://www.edaboard.com/thread99775.html