APPLICATION
Formulated for both standard and fine pitch stencil printing, at print speeds of between 25mm/sec (1”/sec) and 150mm/sec (6”/sec), with stencil thickness of 100μm (4 mil) to 150μm (6 mil), particularly when used with ALPHA® Stencils. Blade pressures should be 0.18-0.27 kg/cm of blade (1.0 -1.5 Ibs/inch), depending upon the print speed. The higher the print speed employed, the higher the blade pressure that is required. The reflow process window will give high soldering yield with good cosmetics and minimized rework.
HALOGEN STATUS
ALPHA® OM-340 is a Zero Halogen product and passes the standards listed in the Table below:
Halogen Standards
Standard
JEITA ET-7304
Definition of Halogen Free Soldering Materials IEC 612249-2-21
JEDEC
A Guideline for Defining "Low Halogen" Electronics
Requirement
< 1000 ppm Br, Cl, F in solder material solids Post Soldering Residues contain
< 900 ppm each or total of < 1500 ppm Br or Cl from flame retardant source
Post soldering residues contain
< 1000 ppm Br or Cl from flame retardant source
Test Method Status
Pass
TM EN 14582
Pass
Pass
Zero Halogen: No halogenated compounds have been intentionally added to this product
SAFETY
While the ALPHA OM-340 flux system is not considered toxic, its use in typical reflow will generate a small amount of reaction and decomposition vapors. These vapors should be adequately exhausted from the work area. Consult the most recent MSDS (available at ) for additional safety information.
STORAGE
ALPHA OM-340 should be stored in a refrigerator upon receipt at 0 to 10°C (32-50°F). ALPHA OM-340 should be permitted to reach room temperature before unsealing its package prior to use (see handling procedures on page 3). This will prevent moisture condensation build up in the solder paste.