深圳市 技术有限公司 文档版本 V2.0 密级 内部公开 金蝶物料编码规范 共30页 拟制： 审核： 签发：
金蝶物料编码规范
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金蝶物料编码规范
目 录
1．范围 ···························································································································· 3 2．基本概念 ···················································································································· 3 3．BOM层次结构说明 ·································································································· 4 4．物料编码构造说明 ···································································································· 5 4.1物料编码规则说明 ································································································· 5 4.2金蝶物料录入说明 ································································································· 5 4.3金蝶物料大类分类 ································································································· 6 5．产品物料编码说明 ···································································································· 7 5.1 代码格式 ················································································································ 7 5.2 代码详细说明 ········································································································ 7 5.3 产品物料录入说明 ································································································ 8 6．元器件及资料物料编码说明 ··················································································· 11 6.1 约定 ······················································································································· 11 6.2 物料录入详细内容 ······························································································· 11 7．金蝶基本使用技巧 ··································································································· 11 7.1 物料的引出功能 ··································································································· 11 7.2 BOM单的引入引出功能····················································································· 12 7.3 BOM单的套打功能····························································································· 12 7.4 自定义物料核算项 ······························································································ 13 7.5 自定义单据 ·········································································································· 13 8．金蝶物料与BOM管理办法 ··················································································· 13 8.1 金蝶物料修改及添加 ·························································································· 13 8.2 金蝶BOM修改及添加······················································································· 14 附表1 电阻编码及金蝶录入 ····················································································· 15 附表2 电容编码及金蝶录入 ····················································································· 16 附表3 电感/互感/变压器编码及金蝶录入 ······························································· 17 附表4 晶体管编码及金蝶录入 ················································································· 18 附表5 IC编码及金蝶录入 ························································································ 19 附表6 IC编码及金蝶录入 ························································································ 20 附表7 晶振/继电器编码及金蝶录入 ········································································ 20
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金蝶物料编码规范
附表8 接插件编码及金蝶录入 ················································································· 21 附表9 接插件/开关/按键/按键帽编码及金蝶录入 ·················································· 22 附表10 保护器件/电源/无线微波/传感告警器编码及金蝶录入 ···························· 23 附表11 线材/包装材料/随机材料编码及金蝶录入 ················································· 24 附表12 结构件/生产辅料/工具/仪器仪表编码及金蝶录入 ···································· 25 附表13 办公材料/试用样品编码及金蝶录入 ·························································· 26 附表14 焊接BOM单模板 ························································································ 27 附表15 装配料BOM单模板 ···················································································· 28 附表16 附表17
包装料BOM单模板 ···················································································· 28 金蝶物料编码申请单 ··················································································· 28
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金蝶物料编码规范
1．范围
本文档规范了金蝶物料编码规则，说明了产品BOM单的结构及使用，制定了金蝶物料及BOM单添加与修改流程，介绍了金蝶的基本使用技巧。其中物料编码规则主要根据《编码规则》V1.0修订完成。
本标准适用于深圳市有限公司内部产品及电子类物料的编码和物料录入规则，适用公司相关部门对金蝶物料及BOM单的使用及基本操作。
2．基本概念
出厂整机
通过检测并包装好能够直接出货的单个产品的统一体，与BOM单中的包装料对应。根据公司产品性质分为监控类、空调类、自制模块类和外购模块4类。 半成品
由制成板和装配整机两大部分组成，从印制PCB焊接了器件到出厂整机前的所有部分都属于半成品。 装配整机
也叫裸机，将产品各部分组装、接插、紧固，并用外壳封装起来能实现产品功能。根据公司产品性质分为监控类、空调类、自制模块类3类装配整机。 制成板
印制PCB板上焊接上元器件之后形成制成板，根据焊接器件是贴片还是插件分为自制制成板和外发制成板。外发制成板是在印制PCB板的基础上焊接贴片器件后的部分；自制制成板是在外发制成板的基础上焊接插件器件后的部分。根据公司产品性质分为监控类、空调类、自制模块类和外购模块4类制成板。 终端软件
安装在计算机上配套产品使用的软件或能独立使用的纯软件。 BOM单
产品生产过程中需要的焊接材料、装配材料、包装材料的电子档清单列表，根据生产流程分为焊接料（制成板）BOM单、装配料BOM单和包装料BOM单。 试样
试用样品，所有第1次在产品开发过程中（还没试产）使用的物料，包括PCB。
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金蝶物料编码规范
3．BOM层次结构说明
原材料层次结构BOM层出厂整机包装料/配件出厂整单机BOM装配整机装配材料自制制成板插件器件装配整单机外发制成板贴片器件自制制单成板印制PCB板外发制单成板BOMBOMBOM
图3-1 金蝶BOM层次结构图
说明：根据生产流程将产品的相关BOM共分为4层，外发制成板层、自制制成板层、装配整机层和出厂整机层，如图3-1所示。其中外发制成板和自制制成板BOM单统一放在制成板类中。4个层次通过添加原材料及相关生产流程逐层递进。 每层分类说明：
① 外发制成板层：所有贴片焊接器件，加上PCB板；
② 自制制成板层：所有需要焊接在板上的插件器件，加上外发制成板； ③ 装配整机层：所有需要插接在制成板上的器件，不同板相连接的配线，螺丝，外壳，加上各种自制制成板；
④ 出厂整机层：所有包装材料、产品配件、随机资料，加上装配整机。
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