多点温度检测系统设计
目 录
摘要 ····················································································· 2 ABSTRACT ··········································································· 3 第一章
绪 论 ······································································· 4
§1.1系统背景 ······························································································ 4 §1.2 系统概述 ····························································································· 4
第二章 方案论证 ·································································· 4
§2.1 传感器部分 ·························································································· 5 §2.2主控制部分 ··························································································· 6 §2.3 系统方案 ···························································································· 6
第三章 硬件电路设计 ······························································ 7
§3.1 电源以及看门狗电路 ·············································································· 7 §3.2键盘以及显示电路 ················································································· 9 §3.2温度测试电路······················································································· 11 §3.3 串口通讯电路 ······················································································ 15 §3.4 整体电路 ···························································································· 16
第四章 软件设计 ································································ 16
§4.1 概述 ·································································································· 16 §4.2 主程序方案 ························································································· 16 §4.3 各模块子程序设计 ················································································ 18
第五章 系统调试 ································································ 20
§5.1 分步调试 ···························································································· 20 §5.2 统一调试 ···························································································· 20
结束语 ················································································ 21 参考文献 ············································································· 22 附录一:软件流程图 ································································ 24 附录二：电路原理图 ······························································ 25 致 谢 ················································································ 27
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多点温度检测系统设计
多点温度检测系统
摘要
DS18B20是一种可组网的高精度数字式温度传感器，由于其具有单总线的独特优点，可以使用户轻松地组建起传感器网络，并可使多点温度测量电路变得简单、可靠。本文结合实际使用经验，介绍了DS18B20数字温度传感器在单片机下的硬件连接及软件编程，并给出了软件流程图。
该系统由上位机和下位机两大部分组成。下位机实现温度的检测并提供标准RS232通信接口，芯片使用了ATMEL公司的AT89C51单片机和DALLAS公司的DS18B20数字温度传感器。上位机部分使用了通用PC。该系统可应用于仓库测温、楼宇空调控制和生产过程监控等领域。
关键字：温度测量；单总线；数字温度传感器；单片机
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多点温度检测系统设计
Abstract
As a kind of high-accuracy digital net temperature sensor，DS18 B20 can be used building a sensor net easily. It can also make the net simple and reliable with it's special 1-wire interface .This paper introduces the application of DS18B20 with single chip processor.
The system is constituted by two parts the temperature measured part and displayed part. The temperature measured part has a RS232 interface. It used AT89C51 of ATMEL company and DS18B20 of DALLAS company .The displayed part uses PC .This system is applied in such domains as warehouse detecting temperature；air-conditioner controlling system in building and supervisory productive process etc.
Key words：temperature measure；single bus；digital thermometer；single chip processor；
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多点温度检测系统设计
第一章 绪 论
§1.1系统背景
在工、农业生产和日常生活中，对温度的测量及控制占据着极其重要地位。首先让我们了解一下多点温度检测系统在各个方面的应用领域：消防电气的非破坏性温度检测，电力、电讯设备之过热故障预知检测，空调系统的温度检测，各类运输工具之组件的过热检测，保全与监视系统之应用，医疗与健诊的温度测试，化工、机械?等设备温度过热检测。温度检测系统应用十分广阔。
§1.2 系统概述
本设计运用主从分布式思想，由一台上位机（PC微型计算机），下位机（单片机）多点温度数据采集，组成两级分布式多点温度测量的巡回检测系统。该系统采用 RS-232串行通讯标准，通过上位机（PC）控制下位机（单片机）进行现场温度采集。温度值既可以送回主控PC进行数据处理，由显示器显示。也可以由下位机单独工作，实时显示当前各点的温度值，对各点进行控制。
下位机采用的是单片机基于数字温度传感器DS18B20的系统。DS18B20利用单总线的特点可以方便的实现多点温度的测量，轻松的组建传感器网络，系统的抗干扰性好、设计灵活、方便，而且适合于在恶劣的环境下进行现场温度测量。本系统可以应用在大型工业及民用常温多点监测场合。如粮食仓储系统、楼宇自动化系统、温控制程生产线之温度影像检测、医疗与健诊的温度测试、空调系统的温度检测、石化、机械?等。
第二章 方案论证
温度检测系统有则共同的特点：测量点多、环境复杂、布线分散、现场离监控室远
等。若采用一般温度传感器采集温度信号，则需要设计信号调理电路、A/D 转换及相应的接口电路，才能把传感器输出的模拟信号转换成数字信号送到计算机去处理。这样，
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多点温度检测系统设计
由于各种因素会造成检测系统较大的偏差；又因为检测环境复杂、测量点多、信号传输距离远及各种干扰的影响，会使检测系统的稳定性和可靠性下降 。所以多点温度检测系统的设计的关键在于两部分：温度传感器的选择和主控单元的设计。温度传感器应用范围广泛、使用数量庞大，也高居各类传感器之首。
§2.1 传感器部分
方案一：
采用热敏电阻，可满足40摄氏度至90摄氏度测量范围，但热敏电阻精度、重复性、可靠性较差，对于检测1摄氏度的信号是不适用的。而且在温度测量系统中,采用单片温度传感器,比如AD590,LM35等.但这些芯片输出的都是模拟信号,必须经过A/D转换后才能送给计算机,这样就使得测温装置的结构较复杂.另外,这种测温装置的一根线上只能挂一个传感器,不能进行多点测量.即使能实现，也要用到复杂的算法，一定程度上也增加了软件实现的难度。 方案二：
在多点测温系统中，传统的测温方法是将模拟信号远距离采样进行AD转换，而为了获得较高的测温精度，就必须采用措施解决由长线传输，多点测量切换及放大电路零点漂移等造成的误差补偿问题。采用数字温度芯片DS18B20测量温度，输出信号全数字化。便于单片机处理及控制，省去传统的测温方法的很多外围电路。且该芯片的物理化学性很稳定，它能用做工业测温元件，此元件线形较好。在0—100摄氏度时，最大线形偏差小于1摄氏度。DS18B20的最大特点之一采用了单总线的数据传输，由数字温度计DS1820和微控制器AT89C51构成的温度测量装置,它直接输出温度的数字信号,可直接与计算机连接。这样,测温系统的结构就比较简单,体积也不大,且由于AT89C51可以带多个DSB1820,因此可以非常容易实现多点测量.轻松的组建传感器网络。
采用温度芯片DS18B20测量温度，可以体现系统芯片化这个趋势。部分功能电路的集成，使总体电路更简洁，搭建电路和焊接电路时更快。而且，集成块的使用，有效地避免外界的干扰，提高测量电路的精确度。所以集成芯片的使用将成为电路发展的一种趋势。本方案应用这一温度芯片，也是顺应这一趋势。
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