最全的芯片封装方式大全
各种IC封装形式图片
QFP Quad Flat BGA Package Ball Grid Array TQFP 100L EBGA 680L LBGA 160L PBGA 217L Plastic Ball Grid Array SDIP SC-70 5L SBGA SIP SBGA 192L Single Inline Package SO Small Outline Package
TSBGA 680L CLCC SOJ CNR Communication and Networking Riser Specification Revision 1.2 SOT220 SSOP 16L SOP EIAJ TYPE II 14L SOJ 32L CPGA Ceramic Pin Grid Array DIP Dual Inline Package SSOP TO18
DIP-tab Dual Inline Package with TO220 Metal Heatsink FBGA TO247 FDIP TO264 FTO220 TO3 Flat Pack TO5 HSOP28 TO52 ITO220 TO71
TO72 ITO3p TO78 JLCC LCC TO8 LDCC TO92 LGA TO93 LQFP TO99 PCDIP TSOP Thin Small PGA Outline Plastic Pin Grid Package Array
TSSOP or TSOP II PLCC 详细规格 Thin Shrink Outline Package uBGA PQFP Micro Ball Grid Array PSDIP LQFP 100L 详细规格 METAL QUAD 100L 详细规格 PQFP 100L 详细规格 uBGA Micro Ball Grid Array ZIP Zig-Zag Inline Package TEPBGA 288L TEPBGA QFP Quad Flat Package C-Bend Lead