工 程 英 文 确 认 常 用 词 及 常 用 语 句 汇 总 厚度 公差 线路层 字符层 外形层 叠层 单词
1. 附件：attached 2. 样品：sample 3. 承认：approval 4. 答复：answer;reply 5. 规格：spec
6. 与...同样的：the same as
7. 前版本：previous version(old version) 8. 生产：production 9. 确认：confirm
10. 再次确认：double confirm
11. 工程问题：engineering query（EQ） 12. 尽快：ASAP(as soon as possible) 13. 生产文件：production gerber 14. 联系某人：contact somebody 15. 提交样板：submit sample 16. 交货期：delivery date
17. 电测成本：ET（electrical test） cost 18. 通断测试：Open and short testing 19. 参考：refer to
20. IPC标准：IPC standard 21. IPC二级：IPC class 2 22. 可接受的：acceptable 23. 允许：permit
24. 制造：manufacture 25. 修改：revision 26. 公差：tolerance 27. 忽略：ignore(omit) 28. 工具孔：tooling hole 29. 安装孔：mounting hole 30. 元件孔：component hole 31. 槽孔：slot
32. 邮票孔：snap off hole 33. 导通孔：via 34. 盲孔： blind via 35. 埋孔：buried via
36. 金属化孔：PTH(plating through hole)
37. 非金属化孔：NPTH( no plating through hole) 38. 孔位：hole location 39. 避免：avoid
孔层 阻焊层 40. 原设计：original design 41. 修改：modify
42. 按原设计：leave it as it is 43. 附边：waste tab 44. 铜条：copper strip
45. 拼板强度：panel strong 46. 板厚：board thickness 47. 删除：remove(delete) 48. 削铜：shave the copper 49. 露铜：copper exposure 50. 光标点：fiducial mark
51. 不同：be different from(differ from) 52. 内弧：inside radius 53. 焊环：annular ring 54. 单板尺寸：single size 55. 拼板尺寸：panel size 56. 铣：routing 57. 铣刀：router 58. V-cut：scoring 59. 哑光：matt 60. 光亮的：glossy
61. 锡珠：solder ball(solder plugs) 62. 阻焊：solder mask(solder resist) 63. 阻焊开窗：solder mask opening 64. 单面开窗：single side mask opening 65. 补油：touch up solder mask 66. 补线：track welds 67. 毛刺：burrs 68. 去毛刺：deburr
69. 镀层厚度：plating thickness 70. 清洁度：cleanliness
71. 离子污染：ionic contamination 72. 阻燃性：flammability retardant 73. 黑化：black oxidation 74. 棕化：brown oxidation 75. 红化：red oxidation 76. 可焊性：solderability 77. 焊料：solder 78. 包装：packaging 79. 角标：corner mark
80. 特性阻抗：characteristic impedance 81. 正像：positive 82. 负片：negative 83. 镜像：mirror
84. 线宽：conductor width 85. 线距：conductor spacing
86. 做样：build sample 87. 按照：as per 88. 成品：finished
89. 做变更：make the change 90. 相类似：similar to 91. 规格：specification 92. 下移：shift down 93. 垂直地：vertically 94. 水平的：horizontally 95. 增大：increase 96. 缩小：decrease
97. 表面处理：Surface Finishing 98. 波峰焊：wave solder 99. 钻孔数据：drilling date 100. 标记：Logo
101. Ul 标记：Ul Marking
102. 蚀刻标记：etched marking 103. 周期：date code 104. 翘曲：bow and twist 105. 外层：outer layer 106. 内层：internal layer 107. 顶层：top layer 108. 底层：bottom layer
109. 元件面：component side 110. 焊接面：solder side
111. 阻焊层：solder mask layer
112. 丝印层：legend layer (silkscreen layer or over layer) 113. 兰胶层：peelable SM layer 114. 贴片层：paste mask layer 115. 碳油层：carbon layer
116. 外形层：outline layer(profile layer) 117. 白油：white ink 118. 绿油：green ink
119. 喷锡：hot air leveling (HAL) 120. 水金：flash gold
121. 插头镀金：plated gold edge-board contacts 122. 金手指：Gold-finger 123. 防氧化：Entek(OSP)
124. 沉金：Immersion gold (chem. Gold) 125. 沉锡：Immersion Tin(chem.Tin)
126. 沉银：Immersion Silver (chem. silver) 127. 单面板：single sided board 128. 双面板：double sided board 129. 多层板：multilayer board 130. 刚性板：rigid board 131. 挠性板：flexible board
132. 刚挠板：flex-rigid board 133. 铣：CNC (mill , routing) 134. 冲：punching 135. 倒角：beveling 136. 倒斜角：chamfer 137. 倒圆角：fillet 138. 尺寸：dimension 139. 材料：material
140. 介电常数：Dielectric constant 141. 菲林：film 142. 成像：Imaging
143. 板镀：Panel Plating 144. 图镀：Pattern Plating 145. 后清洗：Final Cleaning 146. 叠层：layup (stack-up)
147. 污染焊盘：contaminate pad 148. 度数：degree
149. 被…覆盖：be covered with 150. 负公差：minus tolerance 151. 标靶盘： target pad
152. 外形公差：routing tolerance 153. 芯板：core
154. 蓝胶：Peelable solder mask 155. 亚光黑：Matt Black
156. 工艺边：Strip; Frame;breakaway 157. 飞测：Fly-probe
158. 叠层顺序：the order of layers 159. 槽宽度：slot width 160. 过孔：Vias
161. 挡点：Block pad ward ring 162. 分孔图：drill chart 163. 钻带： drill tape
常用语句 －、厚度
1. 要求孔内铜厚0.001\太紧对我们的生产，建议按IPC二级0.0008\。
The copper thickness of the wall of the plated-through holes is specified 0.001\tight for our production. We suggest as per IPC class 2.that's to say ,It's 0.0008\2.要求金手指镀金厚度为1.2-1.5um，我们加工太困难，建议按我们常规0.45um。
The plating thickness of Au in edge contact is specified 1.2-1.5um,it is too tough for us, we suggest following our normal standard ,that is to say 0.45um instead. 3.建议所要求的铜厚2OZ为成品铜厚，而且我们将用基铜1.5OZ电镀到2OZ。
The copper thickness is specified 2OZ .We suggest the finished copper thickness 2OZ. And we will use the base material with 1.5OZ copper thickness and plate to 2OZ for our production.
4.要求锡厚为0.0005-0.003\，我们做不到这么厚，建议按IPC二级，即保证可焊性，
The solder thickness is required to plated 0.0005-0.003\,We can not reach the requirement .We suggest following IPC class 2 for the solder thickness and we will assure the solderability. 二、公差
1. XXX.的尺寸公差为+/-0.005，这要求是太紧对我们生产，建议公差放松到+/-0.008\。
The tolerance of dimension is specified XXX.+/-0.005\suggest +/-0.008\。
2.在*.pdf文件中要求外形公差为+/-0.005\，建议按IPC 二级+/-0.01\代替。
The profile tolerance is specified +/-0.005\，that is to say, it is +/-0.01\
3. 在叠层图中要求板厚公差为+/-0.007\，而notes 1中要求板厚公差为+/-0.005\，他们是不同的，建议0.062\是可接受的，因为+/-0.005\对我们来说太难控制了。
The tolerance of the board thickness is specified +/-0.007\in layup detail which is different form NOTES 1 +/-0.005\suggest 0.062\is acceptable for +/-0.005\
4.外形公差要求+/-0.1mm，这超出了我们生产，建议按+/-0.2mm控制。
The tolerance of the outline is specified +/-0.1mm.It's above us.We suggest +/-0.2mm instead.
5. v-cut留厚公差为+/-0.06mm上下偏移公差为+/-0.05mm，这两个公差都太紧，建议两个公差都按+/-0.1mm控制。
The remain tolerance of v-cut is specified +/-0.06mm and offset tolerance is +/-0.05mm. they are too tight for us,we suggest both tolerance are +/-0.1mm instead. 6.孔位公差为0.05mm，这是太紧对我们，建议用+/-0.076mm替代。
The tolerance of the hole position is specified 0.05mm. It's too tight for us, We suggest +/-0.076mm instead.
7. 角度公差为+/-0.5mm，这是太紧对我们，v-cut角度我们将控制在30+/-5度。
The tolerance of angle is +/-0.5 degree ,it is tight for us , we would like to control the angle of v-cut within 30+/-5 degree.
8.在1MB5476-01.pdf文件中要求孔到板中心的公差是+/-0.05mm，这是太紧对我们，建议安IPC二级。
It is special that the tolerance of the hole to board center is +/-0.05mm in the 1MB5476-01.pdf file,it is too tight for us ,we suggest as per IPC class 2 . 9.要求线宽和线间距公差为+/-0.03，这是太紧对我们，请确认放松到+/-20%。
It stated that conductor width and spacing shall be within +/-0.03(0.001) of gerber data , it is tight for us , we would like to relax to +/-20%.Pls confirm.
10.Φ3.0的孔径公差要求+0.05mm，这太紧对我们，请确认放松到+0.1/-0mm。
The tolerance of the holes with diameter 3.0mm is required to control within +0.05mm ,it is tight for us , we would like to relax to +0.1/-0mm.Pls confirm. 三、线路层
1.两个孔到外形很近，这将引起露铜和破孔，建议允许露铜与破孔。
Two holes are near the outline,it will cause copper exposed and hole broken,we suggest copper exposed and hole broken is permitable. 2.有些盘离外形很近，建议削铜皮0.4mm，避免露铜。
Some pads are close to the outline .We suggest shaving the pads about 0.4mm avoid to the copper exposure.