3. 焊盘延伸出板外，如按原设计，板边将会露铜，建议允许露铜。
The copper pad extend to the board outline, it will lead to copper exposed if we follow Gerber to do,We suggest copper exposed is acceptable.
4.有三个盘离v-cut 线很近将会引起露铜，建议削焊盘0.4mm避免露铜。
The three pads are so close to the v-cut that they will cause copper exposure. We suggest shaving the pads 0.4mm avoid to the copper exposure.
5.底层有些地方线路网格间距仅有0.178mm，这种网格间距我们生产无法做到，建议减小线宽使间距达到0.2mm.
The copper grids on bottom side is only 0.178mm in some places,we can not do it per this gap,so we suggest decreasing the trace width to make copper grids to 0.2mm. 6. 既然没有功能上的影响，我们建议所有层附边均加些铜皮以提高电镀质量。
We suggest putting some extra copper on the waste tab in all layers to improve plating quality since this is no function effect.
7.建议加在顶层空白区域加些铜以提高电镀质量。
We suggest putting some copper in blank area on top side to improve plated quality. 8.我们发现有两处铜皮间距仅有0.013mm，建议把它们连接起来。
We have found that the gap between two block copper is only 0.013mm on bottom side,we suggest they are connected.
9. 两个光标点处在v-cut线上，它们将被削到，我们建议向左边移1.0mm。
The two fiducial marks are over v-groove line . They will be cut . We suggest moving them 1.0mm toward the left . 四、孔层
1. 两个直径2.0MM的孔，4个直径4.0MM的孔，4个直径1.3MM的孔双面没有焊盘，但它们被定义成PTH孔，我们建议做NPTH孔
The 2 holes with dia.2.0mm , 4 holes with dia.4.0mm and 4 holes with dia.1.3mm have no pads on top and bottom copper layer .But they are specified PTH in drill chart. We suggest build them as NPTH.
2．这些孔（直径1.4MM，1.6mm,1.8mm,2.5mm）被定义成PTH孔，但它们的焊盘与孔径等大，我们建议做NPTH孔。
These holes (1.4mm ,1.6mm,1.8mm,2.5mm)are specified PTH .But they have pads which are the same as the holes in copper layer .We suggest them NPTH.
3.六个直径0.25MM的孔在分孔图中定义为NPTH孔，但它们的线路焊盘比孔大，我们建议做PTH孔。
The 6 holes with dia.0.25mm are specified NPTH in drill chart .But they have pads which are larger than the holes in copper layers .We sugget them PTH .
4. 直径0.11“的孔对应的焊盘比孔大，但它们被定义成NPTH孔，我们建议沿孔边削铜皮0.3MM ，请确认
The hole with dia.0.11\layer .But it's specified NPTH.we suggest shaving the pads 0.3mm around the hole.Pls confirm.
5.GERBER中孔的类型没有定义，2个直径0.120“的孔双面没有焊盘，我们想确认这2个直径0.120”的孔为NPTH孔。
The hole type(PTH or NPTH) did not be define in the Gerber, the two holes of diameter 0.120 inch have not copper pads on both sides, we would like to confirm the two holes of diameter 0.120 inch are non-plating holes, please confirm . 6.一些1.5mm的孔靠得非常近，建议把他们制成槽孔。
Some holes with dia.1.5mm are very close each other, we suggest doing them oval hole. 7.有两个Φ0.991、Φ0.762重叠在一起，建议保留一个0.991mm的孔。
There are two holes with dia.0.991 mm and dia.0.762 mm overlap each other in one place,we suggest only dia.0.991mm remain there.
8.在DRD孔表中直径0.012英寸孔数是291，而在钻孔文件中孔数是290，请确认孔数是290而不是291。
The quantity of diameter 0.012 inch in the hole chart of file DRD is 291, but(thruhole,tap) it is only 290. please confirm the quantity of diameter 0.012 inch holes in the drill flie should be 290 not 291.
9.在孔表中标明1.7*1.9mm的槽数量为4个，但gerber中仅有两个，建议按gerber制作。
In the drilldraw file,it stated that the quantity of slots 1.7*1.9mm is 4 ,but we have found two slots in the gerber file ,we suggest as per gerber file. 10.因为铣外形没有定位孔，我们建议附边加四个Φ2.0mm孔。
As no located holes for our routing,we suggest four additional holes with dia.2.0mm in waste tab.
五、阻焊层
1．在字符\处，一些0.065 inch & 0.0461 inch的孔两面没有开窗，未避免阻焊污染焊盘，在对孔双面加开窗。
On the location of \opening on both sides, we would like to add mask opening for these holes to avoid solder resist encroach the solder pad on both sides. 2.这些焊盘仅TOP面有阻焊开窗，为了避免油墨渗上焊盘，我们建议在BOTTOM面也加上与TOP面等大的阻焊开窗
These pads have single side mask opening on the top side , we suggest extra mask opening on the bottom side with same size as pads to avoid mask onto pad.
3.我们发现6个直径0.8MM的孔双面没有阻焊开窗，我们认为它们应为元件孔，建议双面加直径1.75MM的阻焊开窗。
We found the 6 holes with dia.0.8mm have not solder-mask opening on both sides. We think they should be component holes. We suggest putting dia.1.75mm solder mask opening on their pads on both sides.
4.我们发现单板内有些光标点没开窗，这点我们应该按原设计吗？
We found some fiducials without mask opening in the unit.Should we following the original design? 5.锡珠，小挡点
根据原设计多数过孔没有开窗，它们也没有堵孔要求，在我们生产过程中，因为孔内没充满绿油锡将会流进这些孔内，为此我们有三种建议： 建议1：允许部分过孔孔内有锡珠。 建议2：若不同意建议1，我们将对这些孔双面加一比孔大些的开窗，使用这种方法的结果是：
这些过孔的孔壁不会有绿油，过孔焊盘被绿油覆盖但有部分锡环。
建议3：若不同意以上两点，我们将对双面未开窗的过孔进行堵孔，但这将增加成本和增加制
程时间，对我们来说这种是最不利的选择。
我们希望你能选择建议1或建议2。
Most vias have no solder mask opening as per original design and no vias-plugged request .During our process, the solder will flow into the vias ,for they aren't filled with solder resist completely.So our suggestion have three:
suggestion1 :Solder ball in partial vias is permitted.Pls confirm.
suggestion2: If you don't agree with our suggestion 1, we would like to put an opening with a size little larger than holes on both side .In this way,the wall of the vias will have no any solder resist ,one partial pads will be soldered and the other will be covered with solder resist.Pls confirm.
suggestion3: If you don't agree with above two,we will have to plug those vias which have no opening on both side with solder resist . But it will increase our production cost and cause lead-time much. It is the worst way for us. We would like to hope you could choose our suggestion 1or 2.
9. 过孔要求堵孔，但一些过孔顶层有开窗，建议保留过孔开窗且对Φ0.46mm的过孔堵孔。
The via is specified to be plugged. But some vias have mask opening in top layer. We suggest all vias with dia.0.406mm will be plugged and their mask opening in top layer will be kept.
12. 根据原设计光标点开窗压到周围的些线或盘，建议削光标点开窗，避免露线。
In the borad ,some soldermask opening of fiducial marks cover the nearby traces or pads on top side per original design. We suggest that shave a little soldermask opening of fiducial marks to avoid the trace exposed .
14. 开窗与线路盘现状不同，我们应该修改开窗使按键处全部上金还是依据原设计制作？
The solder mask opening shape mismatch the circuit pad , should we modify the solder mask opening shape to assure all the key pad will be covered with gold completely , or we will follow Gerber to do .
15. 能我们使用太阳PSR 2000油墨代替太阳PSR 4000油墨？因为我们没有这类型的油墨。
Can we use the solder-mask type with TAYO ink PSR 2000 instead of TAYO ink PSR 4000 H85?because we have not this type
六、字符层
1.大部分的丝印字符都在焊盘上。我们建议此板没有白字，如果需要丝印字符，我们建议删去上焊盘的字符。
Most of silkscreen is on the pads, we suggest no silkscreen, if we need to do silkscreen we suggest removal of those which are on pads.
2.原设计白油上焊盘，为了避免油墨污染焊盘，我们建议削去上焊盘的白油，请确认。
There is white ink on the top pads per original design, We suggest shaving the white ink in case of they contaminate pads. Pls confirm.
3.一些字符靠近焊盘，恐怕它们会污染焊盘，建议允许削少许字符，也就是说字符残缺是允许的。
Some legends are close to pads .we are afraid they will contaminate the pads.so we suggest shaving them a bit.that is to say the defective legends is permittable.
4.GERBER文件没有发现丝印层，因此建议此板没有字符，如果需要丝印字符，请将字符文件发给我们。
We didn't find any silkscreen layer in gerber file. So we suggest no silkscreen layers .If need ,Pls send us the file. 5.在U1和U5区域，两个IC焊盘的间距只有0.3MM ，如果按原设计制作，白油会污染焊盘，要不白油做少许更改，白油上焊盘是允许的。
In U1 & U5 area the gap between two IC pads is only 0.3mm and the white ink will
contaminate pads if we follow the original gerber, the other is to make minor change to white ink and IC pads contaminated is allowed.Pls confirm.
6.按原设计，字符在大锡面上，是否为了避免白油污染锡面需要削掉白油，或者需要我们按原设计制作？请指示
The notation just lie on the large solder pad per original design , if need us to shave ink to avoid ink contaminate the solder pad or need us to follow gerber to do? please advise. 7. 所有底层字符都没镜像，建议没有底层字符或如果要做出他们需要镜像，请提出你的建议。
All the legends on bottom side are no mirror per gerber file,we suggest no bottom side silkscreen or they are mirror if we need to do them.Pls advise. 8．在GM4层有些字符，我们忽略它们或是加到顶层？
There are some legends on the GM4,should we omit them or put them on top side silkscreen?
9.由于单元比较小，没有足够的空间加我们的UL标志及周期在每个单元内，我们只能丝印我们的UL标志及周期在附边。
As the unit is so small ,there is no large enough bare space to add our UL logo and date code in each unit we have to add our UL logo and date code on the waste tab by silkscreen.
10.我们发现其他制造商的标志及周期在附边上，我们建议用我们的UL标志及周期替代加在附边上（同样板一样），请确认。
We find the LOGO and the date code of other PCB manufacture is only in waste tab. We suggest using our LOGO instead.(is only in waste tab the same as the sample.).Pls confirm.
11.顶层字符模糊不清，是否按3.bmp图示修改？
The legend is illegibility on the top layer silkscreen. Should we modify it as 3.bmp? 12.板外有些字符和线路，建议删去,请确认。
There are some circuit & notation out of the board,we suggest delete them.pls confirm. 13. 字符层有些网格间距仅有0.076mm,对我们生产来说间距太小，建议按图示修改。
In top silkscreen layer, There is some grids.But the space is only 0.076mm .The space is too small to produce. We suggest modifying these grids like 3.bmp shown.
七、外形层
1. *.DWG中没体现拼板方向，建议拼板按照我们附件中的图所示。
We suggest panelization per our attached drawing for it does not show the unit-pcb's exact direction in the *.DWG.
2. 单板外形与拼板外形不重合，建议按单板调整外形。
The unit outline cann’t match the panel profile.We suggest following the unit outline to modify.
3. 标注尺寸与实测尺寸不同，建议以标注尺寸为准。
The actual gerber dimension is different from the description in drill chart.we suggest per actual gerber.
4.建议v-cut留厚按前版本0.3+/-0.1mm控制。
We suggest the remain of the v-cut line as per old version.(0.3+/-0.1mm).
5.要求的v-cut角度是30-45度，但我V-CUT 刀是30, 45,60度，它们的公差是+/-5度，因此我们建议V-CUT角度30+/-5是允许的。
The angle of V-CUT is specified 30-45 degree.But our normal reamer of V-CUT is only 30， 45,60 degree.Their tolerance is +/-5 degree .So we have to suggest
the angle of V-CUT 30+/-5 degree is permitted. 6.建议附边与拼板相连以增加强度。
We suggest waste tabs connected around the panel to have it stronger.
7. 在gerber 文件中我们没有发现有外形层，请发外形文件给我们，否则我们无法制作。
We did not find the outline of the board in gerber file ,please send outline gerber file to us,otherwise we can not manufature this board .
8. 依据原设计槽宽仅有1.0mm，是否允许我们扩大成2.0mm，以提高生产效率？
The solts are only 1.0mm in original gerber,can we expand them to 2.0mm to improve our production efficiency?
10. 此板尺寸较大，而邮票孔间距仅有0.15mm,建议增加间距到0.45以提高板的强度。
The gap between snap off holes is only 0.15mm,and the size of board is large. We suggest decreasing the snap off holse (dia.0.599mm) to 0.45mm to get the web stronger.
六、叠层
1.在文件中未指定叠层顺序，我们确认叠层顺序为：top--gnd--In1--In2--pwr—bot。
In the Gerber file, the layup sequence did not be defined, we would like to confirm the layup sequence is as below:top--gnd--In1--In2--pwr--bot.
2. 此板叠层有特殊要求（见图2”A”所示），但我们没有40mil的芯板（注：不含铜厚），我们不得不建议叠层按图2”B”所示制作。
The board stack-up is specified.(see A of picture2),but we haven't no 40mil core. We have to suggest board stack-up per B of picture2. 3.文件readme.txt规定芯板的厚度是0.7+/-0.1MM，我们不能确定0.7MM是否包含铜箔的厚度，我们想确定0.7MM是不含铜厚的，请确认
In the readme.txt file ,it is specified that the thickness of inner core is 0.7+/-0.1mm , we don’t know if the core 0.7mm include the copper or not , we would like to confirm the core 0.7mm excluding copper foil ,please confirm
4. 文件readme.txt规定内层的铜箔厚度是18UM ，但我们没有0.7MM 18/18UM的芯板，为了缩短产品的交货时间，我们是否可以使用35UM铜箔0.7MM的芯板？请确认。
In the readme.txt file ,it stated that 18/18um copper inner layer ,but we have not 0.7mm core with 18um copper thickness now ,in order to shorten the lead time of production , can we use 0.7mm core with 35um copper ?