基于单片机的光立方的设计
基于单片机的光立方的设计
摘 要
本设计制作出一个三维立体显示图案的LED光立方。本产品不仅可以像发光二极管点阵一样显示平面的静态或动态画面，还可以显示立体的静态或动态画面，打破了传统的平面显示方案。同时又增加了显示的花样和立体图案显示效果，可以广泛用于传媒信息显示和各种装饰显示，为将来显示技术的进步和发展指导了方向，光立方显示比发光二极管点阵更具有视觉效果，而且画面图案更加非富多彩。
本设计是采用AT89S52单片机为核心控制器，八D边沿触发器（三态）74LS574扩展I/O口，完成硬件电路设计。通过软件编程控制数据下载到单片机完成设计图案的显示。软件采用自上而下的模块化设计思想，使系统朝着分布式、小型化方向发展，增强系统的可扩展性和运行的稳定性。
关键词 51单片机/74LS574锁存器/8*8*8/LED显示
I
基于单片机的光立方的设计 THE DESIGN OF LIGHT CUBE BASED
ON THE MICROCONTROLLER
ABSTRACT
This design produced a three-dimensional pattern of the LED light cube. This product can not only like a light-emitting diode dot matrix display plane static or dynamic screen can also display three-dimensional static or dynamic images， and to break the traditional program.While increasing the display patterns and three-dimensional effect can be widely used to display and decorative display for future progress and development to guide the direction， light cube display more visual effects than the light-emitting diode dot matrix， and the picture is more rich colorful. With a combination of graphics and characters more perfect display characteristics.
The design is AT89S52 MCU core controller， eight D edge flip-flop 74LS574 (tri-state) expansion I / O port completion of the hardware circuit design. Programmed by software to control the data is downloaded to the MCU to complete the designs of the show. This design software is a top-down modular design， the system moving in the direction of distributed， small development， enhance the stability of the system's scalability and running.
KEY WORDS 51 single-chip, 74LS574 latch, 8 * 8 * 8, 3DLED
II
基于单片机的光立方的设计 目 录
摘 要 ......................................................................................................................... I ABSTRACT ............................................................................................................. II 1 绪论 ........................................................................................................................ 1 1.1 国内外LED显示屏的发展概况 ............................................................ 1 1.2 我国LED显示屏研究现状及发展趋势 .............................................. 1 1.3 设计的总体要求及方案选择 .................................................................. 2 1.4 设计说明书的结构安排 ............................................................................ 2 2 系统总体方案设计 ............................................................................................ 4 2.1 系统总体硬件方案选择 ............................................................................ 4
2.1.1 3D显示屏核心控制器 ................................................................................ 4 2.1.2 电源电路 ..................................................................................................... 5 2.1.3 I\\O口扩展芯片 ........................................................................................... 5 2.1.4 层面控制驱动电路 ..................................................................................... 6 2.1.5 串口通讯芯片的选择 ................................................................................. 6 2.1.6 LED发光显示二级管 ................................................................................. 6 2.1.7 硬件电路绘图软件 ..................................................................................... 7
2.2 系统总体软件方案选择 ............................................................................ 8
2.2.1 单片机编程语言 ......................................................................................... 8 2.2.2 系统软件编译器WAVE介绍.................................................................... 9
3 系统硬件方案设计 .......................................................................................... 10 3.1 硬件整体设计概述及功能分析 ............................................................ 10 3.2 电源供电系统设计 ................................................................................... 10 3.3 51系列单片机简介 ................................................................................... 11
3.3.1 时钟电路设计 ........................................................................................... 11
基于单片机的光立方的设计 3.3.2 复位电路设计 ........................................................................................... 13
3.4 驱动电路设计 ............................................................................................. 13
3.4.1 层驱动电路设计 ....................................................................................... 13 3.4.2 列驱动电路设计 ....................................................................................... 15
3.5 通信系统硬件设计 ................................................................................... 16 3.6 光立方的制作及工作原理介绍 ............................................................ 17
3.6.1 3D LED光立方搭接 ................................................................................. 17 3.6.2 3D LED光立方工作原理 ......................................................................... 19
4 系统软件方案设计 .......................................................................................... 21 4.1 概述 ............................................................................................................... 21 4.2 主程序设计 ................................................................................................. 21 4.3 显示程序的设计 ........................................................................................ 22
4.3.1 LED显示屏的数据传送 ........................................................................... 22 4.3.2 显示程序的设计 ....................................................................................... 22
4.4 软件中防止程序出错ERR处理 .......................................................... 23 4.5 ISP软件程序下载 ..................................................................................... 24 5 光立方PCB版制作 ........................................................................................ 25 5.1 PROTUES制作PCB版图 .......................................................................... 25
5.1.1 绘制电路原理图并仿真测试 ................................................................... 25 5.1.2 加载网络表及元件封装 ........................................................................... 26 5.1.3 规划电路板并设置相关参数 ................................................................... 27 5.1.4 元件布局及调整 ....................................................................................... 28 5.1.5 元件布线及调整 ....................................................................................... 29 5.1.6 输出及制作PCB ...................................................................................... 30
5.2 PCB版的制作过程 ................................................................................... 30
5.2.1 热转印版图 ............................................................................................... 31 5.2.2 蚀刻去铜 ................................................................................................... 31 5.2.3 去墨打孔 ................................................................................................... 31
基于单片机的光立方的设计 6 系统测试及仿真 .............................................................................................. 32 6.1 硬件系统测试 ............................................................................................ 32 6.2 软件系统测试 ............................................................................................ 33 6.3 系统总体测试 ............................................................................................ 33 6.4 系统测试结果与结论 .............................................................................. 34
6.4.1 测试结果分析 ........................................................................................... 34 6.4.2 测试结论 ................................................................................................... 34
总 结 ...................................................................................................................... 35 致 谢 ...................................................................................................................... 37 参考文献 ................................................................................................................. 38 附录1 总体电路原理图 .................................................................................... 39 附录2 电路PCB版图 ....................................................................................... 40 附录3 电路3D仿真图 ..................................................................................... 41 附录4 元器件清单 ............................................................................................. 42 附录5 电路实物图 ............................................................................................. 44 附录6 源程序 ...................................................................................................... 45