CONTENTS
1. QUALITY GOALS 1.1. TOTAL DELIVERY QUALITY DPPM 1.2. CPK (PROCESS CAPABILITY INDEX) 1.3. AFR (ANNUAL FAILURE RATE) 1.4. SUPPLIER INTERNAL QUALITY
2. GENERAL 2.1. MANUFACTURING LOCATIONS 2.2. CRITICAL CONTACTS
2.3. QUALITY SYSTEMS AND PROCESS AUDITS 2.4. JQE PROGRAM
2.5. DIFFERENCE IN CURRENT PROCESS VS NEW PROCESS
3. QUALIFICATION 3.1. CRITICAL COMPONENTS 3.2. CRITICAL PARAMETERS
3.3. PRODUCT PROCESS FLOWS
3.4. GAUGE REPEATABILITY AND REPRODUCIBILITY 3.5. PROCESS CAPABILITY (CP/CPK)
3.6. FAILURE MODE EFFECT ANALYSIS (FMEA) 3.7. FIRST ARTICLE INSPECTION
4. CHANGE MANAGEMENT 4.1. ENGINEERING/PROCESS CHANGE NOTIFICATION
5. QUALITY CONTROL 5.1. INCOMING QUALITY CONTROL (IQC) 5.2. IN PROCESS QUALITY CONTROL 5.3. AGING TEST (BURN IN)
5.4. PQE/ONGOING RELIABILITY TEST (ORT) 5.5. OUT GOING QUALITY (OQC) 5.6. OUT OF BOX AUDIT (OBA)
5.7. LINE STOP AND STOP SHIP CRITERIA
5.8. CLOSED LOOP CORRECTIVE ACTION PROCESS 5.9. REWORK/SCREENING OF PRODUCT
6. NEW PRODUCT READINESS REVIEW
6.1. REQUIREMENTS
7. REPORTING 7.1. SUPPLIER
7.1.1. QMP REPORTING
7.1.2. MINIMUM REQUIREMENTS 7.1.3. LIST OF REPORT ITEMS 7.2. PHILIPS PAC FAILURE REPORT
8. EXCEPTIONS TO PHILIPS REQUIREMENTS 8.1. DETAILS
1. QUALITY GOALS
During the initial stage (within 6 weeks) for each family, the Line Reject will be 2200 DPPM, the Out-going and Sourcing inspection target will be 900 DPPM.
1.1. Total Delivery Quality DPPM Goal:
Item Y2002 Q1 Y2002 Q2 Y2002 Q3 Y2002 Q4
Line Reject DPPM 2200 2050 1900 1800 (Philips – PA Sites)
Sourcing Inspection DPPM 900 700 500 400 (Philips – PCBA)
1.2. CPK Goal
Reject
Minimum
Goal
1.3. AFR Goal (Annual Failure Rate Verified Only)
Goal
1.4. SUPPLIER INTERNAL QUALITY GOAL
1st Quarter 1.4.1. Soldering DPPM
1.4.1.1. Reflow Oven 25 20 15 101.4.1.2. Wave solder 25 20 15 10
1.4.2. ICT In-Circuit Test(%) 99.5 99.6 99.7 99.8
1.4.3. Functional Test(%) 0.5 0.4 0.3 0.2
1.4.4. Out-going Quality – By Line Weekly
1.4.4.1. Lot reject rate(%) 2 1.8 1.6 1.51.4.4.2. Defect rate DPPM 900 700 500 400
<1.0 1.0-1.32 = > 1.33 0.8 % nd Quarter 3rd Quarter
th
Quarter
2 4
2. GENERAL
2.1. MANUFACTURING LOCATIONS (appendix A)
2.1.1. The supplier will complete the Manufacturing Location Matrix 1-WEEK after trial run
(see Appendix A). The Philips SQA must approve the Manufacturing Location Matrix before the manufacturing of any Philips product. Any changes to the matrix will require 90-day prior notification to the Philips SQA organization.
2.2. CRITICAL CONTACTS (appendix B)
2.2.1. The supplier will complete the Critical Contacts List 1-WEEK after trial run (see
Appendix B). The Philips SQA will approve any changes to the Critical Contacts List before the implementation is made.
2.3. QUALITY SYSTEMS AND PROCESS AUDITS (APPENDICES B1 , B2)
2.3.1. Factory Audit Results
2.3.1.1. As part of the Supplier Selection process the Philips LSQA will perform a
Quality Systems Audit and a Quality Process Audit (QPA will be completed Prior to RTS). An audit report(s) will be attached in this section of the QMP Prior to RTS.
2.3.2. Major Sub Assembly Suppliers (Appendix B3)
2.3.2.1. The supplier will identify all major sub-assembly manufacturing facilities and
will report to the Philips SQA the audit schedules/results of the audits Prior to RTS.
N/A
2.4. JQE PROGRAM (Joint Quality Engineer)
2.4.1. Supplier will support the JQE program. Supplier JQE’s will be staffed in all Supplier
manufacturing sites.
2.4.2. JQE ACTION PLANS (appendix C)
2.4.2.1. The JQE will develop SQA Action plan, the JQE action plan will be submitted
and approved by Philips SQA. These plans will contain the duties in which the JQE perform. The Supplier will report on the JQE activities on a Weekly basis.
2.5. DIFFERENCE IN CURRENT PROCESS VS NEW PROCESS.
2.5.1. The supplier will provide a summary of the current process vs. this new process. It
will be attached in this QMP 1-Week after the trial run.
3. QUALIFICATION 3.1. CRITICAL COMPONENTS (appendix D)
3.1.1. Critical Components Quality Monitoring (Appendices I & L)
3.1.1.1. Supplier will report quality performance of all critical components at incoming
inspection and in process. A corrective action plan will be required for those components that are producing a negative trend and/or yield result greater than the established quality goal.
3.2. CRITICAL PARAMETERS
3.2.1. Critical Parameter Listing (appendix E)
3.2.1.1. Philips and the Supplier will identify the critical parameters for the specific
product. The Supplier will provide a critical parameter test plan to the Philips SQA for approval Prior to RTS. The following are the minimum critical parameters that will be monitored see appendix E.
? Functional Test
o B+ Voltage
o HV (High Voltage)
o HV Shut Down (High Voltage)
3.2.2. Critical Parameters Quality Monitoring (appendix E)
3.2.2.1. These product performance parameters are controlled once process
capability has been established. Reference “Process Capability” section for requirements. Quality information will be submitted to the Philips SQA on a Weekly basis, see appendix E). Statistical variations will be reported, details include out of control situation, CA/PA responsibility and closure date.
3.3. PRODUCT PROCESS FLOWS
3.3.1. The supplier will provide Philips a detailed product/process flow chart Prior to RTS.
This flow chart will identify all process from receiving inspection to final shipping. The requirements include the following. ? Process flow by station ? Operation performed ? Critical Parameters ? Material Used ? Inspection Checkpoints ? Control Points/Specifications ? Tools and/or Equipment ? Inspection Methods ? Sampling plan or SPC type ? Process owner ? Process control reaction procedures
3.3.2. Changes to the Product Process Flows
3.3.2.1. All Changes to the Product Process Flows will be revision controlled and
processed via the EC/CP/FN control list (appendix G). Changes cannot be made without Philips approval and notification.
APPENDIX a – Process Flow
3.4. GAUGE REPEATABILITY AND REPRODUCIBILITY (appendix F)
Supplier will submit a listing of all gauges that will be controlled through the GR&R process Prior to RTS. Gauge R&R for manufacturing-measuring equipment will be performed prior to the follow occurrences. Raw data and summary results will be submitted to the Philips SQA prior to implementation.
N/A
New product introduction
Major changes to line configuration or equipment New line introductions
Statistical capability beyond control limits
The gauge will be removed from the process if the results of the Gauge R&R are greater than 30%. The GR&R worksheets and results will be reported to Philips SQA prior to RTS (product release) at Philips. ? R&R < 10% ? Acceptable. tolerance ? 10% > R&R =< 30% ? Conditionally acceptable dependent on importance of
application cost of gauge, engineering approval, etc. tolerance
? R&R > 30% ? Not acceptable. Repair, retrain, or use other
measurements means. tolerance
GR&R studies should be used to assist in determining the precision, major problems, amount of variation, and acceptability of all gauging systems used throughout the manufacturing process. It will also furnish a comparison of the accuracy of one measuring device against another.
Engineers may believe that they have an applicable and functional gauging system based on the perceived accuracy or design, but often the accuracy of the gauge is wrong because a major portion of the specification tolerance is lost to measurement errors, incorrect usage, or equipment variation.
Every piece of measuring equipment is subject to a certain amount of variation. It is then in our best interest to conduct a study of the measuring equipment to determine if it is both \
? ? ? ?
1. accuracy, 2. stability,
3. repeatability,