摘要
摘 要
一般的电子元件在制造过程中温度的影响对成品影响是很大的。LTCC中陶瓷、银在共烧过程中因为收缩值的不匹配而产生烧结应力,而升温至最高温时结构体因为热膨胀系数会产生热应力，随着温度降至室温应力无法消除，在结构体内部便有残留应力的存在，此疲劳过程会使成品可靠性缩短而失去其电子回路的功能。而本文利用有限元软件ANSYS来研究经历温度时间历程下材料的机械性质改变所造成的应力现象及变形情况，最主要的工作是分析工烧过程和疲劳过程中的温度、应力情况，总结出影响互连通孔可靠性因素，从而对实际生产过程中互连通孔工艺提供指导。
关键字：LTCC，共烧过程，疲劳过程，应力，可靠性
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ABSTRACT
ABSTRACT
Effect of electronic components in the manufacturing process of the product is greatly affected by the temperature. Ceramics and silver of LTCC in CO firing process does not match the shrinkage and sintering stress because of the Shrinkage, the structure up to maximum temperature will produce thermal stress because of the coefficient of thermal expansion, with the ambient temperature stress can not be eliminated, there has a lot of stress in vivo structure, the fatigue process can make the product lose its electronic circuit function and reliability. And by using the finite element software ANSYS to study the experience of temperature time course changes in the mechanical properties of the material under the stress and deformation, the main work is the analysis of combustion process and fatigue in the process of temperature and stress, and concludes the influences of intercommunicating through-hole reliability and thus provide guidance to interconnect via the actual production process.
Keywords：Co firing process,fatigue,stress,reliability
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目录
目 录
第1章 引言 ..................................................................................................................... 1 1.1 绪论 ........................................................................................................................ 1 1.2 低温共烧陶瓷（LTCC）发展现状 ...................................................................... 2 1.3 低温共烧陶瓷（LTCC）应用情况 ...................................................................... 3 1.4 低温共烧陶瓷（LTCC）制造过程简介 .............................................................. 4 1.5 低温共烧陶瓷（LTCC）的优点 .......................................................................... 8 1.6 研究意义 ................................................................................................................ 9 第2章 有限元软件及基本理论介绍 ........................................................................... 11 2.1 分析软件ANSYS简介 ....................................................................................... 11 2.2 有限元分析方法简介 .......................................................................................... 12 2.3 热传导理论 .......................................................................................................... 14 2.4 力学理论 .............................................................................................................. 15 2.5 结构热传耦合分析模式 ...................................................................................... 17 2.6 非线性分析理论 .................................................................................................. 18 第3章 有限元模型建立 ............................................................................................... 21 3.1 材料性质描述 ...................................................................................................... 21 3.1.1 陶瓷基板材料性质描述 ............................................................................... 21 3.1.2 银膏材料性质描述 ....................................................................................... 21 3.2 基本假设 .............................................................................................................. 22 3.2.1 材质假设 ....................................................................................................... 22 3.2.2 模型架构及几何描述 ................................................................................... 24 3.3 边界条件及材质假设 .......................................................................................... 25 3.3.1 边界条件及网格化 ....................................................................................... 25 3.3.2 模拟材质假设 ............................................................................................... 26 第4章 模拟结果与讨论 ............................................................................................... 28 4.1 前言 ...................................................................................................................... 28 4.2 温度场分析 .......................................................................................................... 28 4.3 烧结过程分析 ...................................................................................................... 33
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