Step 13
* After removing the screws and popping off the antenna, the mid-plane can be removed from the N8.
（旋下螺丝，取出天线部分之后，中间平面部分可以从N8分离。）
* The design of the steel mid-plane is pretty genius. Nokia integrated a large EMI shield into the mid-plane to protect the main chips. In addition, thermal pads were placed on the inner face of the mid-plane to conduct heat away from the main chips. （不锈钢中间平面的设计非常优秀，诺基亚有一个完整的电磁防护中间平面保护主要的芯片组。另外，这种设计便于主要芯片组的散热。）
* As processor speeds increase and devices become more integrated, the need for thermal management becomes critical to ensure longevity and operability in many environments. （随着处理器速度的提示，内部结构更加整体化，为了延长使用寿命、适应不同的环境，需要很好的散热处理。）
Step 14
* After the mid-plane is removed, the motherboard can be simply lifted out of the rear case. （中间部分取出之后，主电路板可以很容易的取出。） [color=****]手机之家
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* The daughter board at the top of the motherboard has an interesting design in that it is connected to the main motherboard via a ribbon cable that is sandwiched between the many layers of the motherboard.
（位于主电路板上方的子电路板有一个很有趣的设计，它们通过排线相连，组成三明治的形状。
o On most devices, ribbon cables are attached with ZIF connectors or are soldered to the surface of the board, not sandwiched between layers. （在大部分的手机上，ZIF连接线是焊接在主板表面的，而不是类似这样三明治层的结构。）
Step 15
* The Nokia N8 motherboard: （诺基亚N8的主板）
o Toshiba THGBM1G7D4FBA13 K23538 (16 GB Internal Memory) o Samsung K5W4G2GACA - AL54 (CPU + DDR RAM + NAND ROM) o Broadcom BCM2727 GPU with dedicated 3D Graphics
o 4380044 9920Q VJ (RF Transceiver) from STMicroelectronics o EPCOS D1053 (RF Front end module) o RENESAS 09801A (RF Power amplifier)
o 4376057 GAZ0035G (Baseband) from Texas Instruments