STM32FEBKx6
STM32FEBKx8STM32FEBKxB
Performanceline,ARM-based32-bitMCUwithFlash,USB,CAN,seven16-bittimers,twoADCsandninecommunicationinterfacesPreliminaryData
Features
?Core:ARM32-bitCortex?-M3CPU?72MHz,90DMIPSwith1.25DMIPS/MHz?Single-cyclemultiplicationandhardwaredivision?Nestedinterruptcontrollerwith43maskableinterruptchannels?Interruptprocessing(downto6CPUcycles)withtailchaining?Memories?32-to-128KbytesofFlashmemory?6-to-20KbytesofSRAM?Clock,resetandsupplymanagement?2.0to3.6VapplicationsupplyandI/Os?POR,PDR,andprogrammablevoltagedetector(PVD)?4-to-16MHzquartzoscillator?Internal8MHzfactory-trimmedRC?Internal32kHzRC?PLLforCPUclock?Dedicated32kHzoscillatorforRTCwithcalibration?Lowpower?Sleep,StopandStandbymodes?VBATsupplyforRTCandbackupregisters?2x12-bit,1μsA/Dconverters(16-channel)?Conversionrange:0to3.6V?Dual-sampleandholdcapability?Synchronizablewithadvancedcontroltimer?Temperaturesensor?DMA?7-channelDMAcontroller?Peripheralssupported:timers,ADC,SPIs,I2CsandUSARTsLQFP487x7mm
LQFP10014x14mm
LQFP6410x10mm
BGA10010x10mm
?Debugmode?Serialwiredebug(SWD)&JTAGinterfaces?Upto80fastI/Oports????32/49/805V-tolerantI/OsAllmappableon16externalinterruptvectorsAtomicread/modify/writeoperationsUpto7timers?Uptothree16-bittimers,eachwithupto4IC/OC/PWMorpulsecounter?16-bit,6-channeladvancedcontroltimer:upto6channelsforPWMoutputDeadtimegenerationandemergency?stop?2x16-bitwatchdogtimers(IndependentandWindow)?SysTicktimer:a24-bitdowncounter??Upto9communicationinterfaces?Upto2xI2Cinterfaces(SMBus/PMBus)?Upto3USARTs(ISO7816interface,LIN,IrDAcapability,modemcontrol)?Upto2SPIs(18Mbit/s)?CANinterface(2.0BActive)?USB2.0fullspeedinterfaceTable1.DevicesummaryRootpartnumberSTM32FEBKC6,STM32FEBKR6STM32FEBKC8,STM32FEBKR8STM32FEBKV8STM32FEBKRBSTM32FEBKVBReferenceSTM32FEBKx6STM32FEBKx8STM32FEBKxBJuly2007Rev21/67www.st.com
Thisispreliminaryinformationonanewproductnowindevelopmentorundergoingevaluation.Detailsaresubjecttochangewithoutnotice.
ContentsSTM32FEBKxxContents1.Introduction.........................................................................................................................62.Description...........................................................................................................................6
2.1.Deviceoverview...........................................................................................................................72.2.Overview8
3.Pindescriptions................................................................................................................154.Memorymapping..............................................................................................................225.Electricalcharacteristics................................................................................................23
5.1.Testconditions..........................................................................................................................23
5.1.1.5.1.2.5.1.3.5.1.4.5.1.5.5.1.6.5.1.7.Minimumandmaximumvalues................................................................................................23Typicalvalues23Typicalcurves23Loadingcapacitor.......................................................................................................................23Pininputvoltage.........................................................................................................................23Powersupplyscheme................................................................................................................24Currentconsumptionmeasurement.........................................................................................255.2.Absolutemaximumratings......................................................................................................265.3.Operatingconditions................................................................................................................27
5.3.1.5.3.2.5.3.3.5.3.4.5.3.5.5.3.6.5.3.7.5.3.8.5.3.9.Generaloperatingconditions....................................................................................................27Operatingconditionsatpower-up/power-down....................................................................27Embeddedresetandpowercontrolblockcharacteristics.....................................................28Embeddedreferencevoltage....................................................................................................28Supplycurrentcharacteristics...................................................................................................29Externalclocksourcecharacteristics.......................................................................................33Internalclocksourcecharacteristics........................................................................................37PLLcharacteristics.....................................................................................................................38Memorycharacteristics..............................................................................................................395.3.10.EMCcharacteristics...................................................................................................................405.3.11.Absolutemaximumratings(electricalsensitivity)...................................................................425.3.12.I/Oportpincharacteristics........................................................................................................435.3.13.NRSTpincharacteristics...........................................................................................................472/67STM32FEBKxxContents5.3.14.TIMtimercharacteristics...........................................................................................................485.3.15.Communicationsinterfaces.......................................................................................................495.3.16.CAN(controllerareanetwork)interface..................................................................................545.3.17.12-bitADCcharacteristics.........................................................................................................545.3.18.Temperaturesensorcharacteristics.........................................................................................586.Packagecharacteristics.................................................................................................59
6.1.Thermalcharacteristics...........................................................................................................64
7.Ordercodes.......................................................................................................................65
7.1.Futurefamilyenhancements..................................................................................................65
8.Revisionhistory................................................................................................................66
https://houcheng-power.taobao.comwww.st.com3/67ListoftablesSTM32FEBKxxListoftablesTable1.Table2.Table3.Table4.Table5.Table6.Table7.Table8.Table9.Table10.Table11.Table12.Table13.Table14.Table15.Table16.Table17.Table18.Table19.Table20.Table21.Table22.Table23.Table24.Table25.Table26.Table27.Table28.Table29.Table30.Table31.Table32.Table33.Table34.Table35.Table36.Table37.Table38.Table39.Table40.Table41.Table42.Table43.Table44.Table45.Table46.Table47.Devicesummary.................................................................................................................................1Devicefeaturesandperipheralcounts(STM32FEBKxxperformanceline)..............................7Pindefinitions...................................................................................................................................18Voltagecharacteristics....................................................................................................................26Currentcharacteristics....................................................................................................................26Thermalcharacteristics...................................................................................................................27Generaloperatingconditions.........................................................................................................27Operatingconditionsatpower-up/power-down.........................................................................27Embeddedresetandpowercontrolblockcharacteristics.........................................................28Embeddedinternalreferencevoltage...........................................................................................28MaximumcurrentconsumptioninRunandSleepmodes.........................................................29MaximumcurrentconsumptioninStopandStandbymodes....................................................30TypicalcurrentconsumptioninRunandSleepmodes..............................................................31TypicalcurrentconsumptioninStopandStandbymodes.........................................................32High-speedexternal(HSE)userclockcharacteristics...............................................................33Low-speedexternaluserclockcharacteristics............................................................................33HSE4-16MHzoscillatorcharacteristics......................................................................................35LSEoscillatorcharacteristics(fLSE=32.768kHz)......................................................................36HSIoscillatorcharacteristics..........................................................................................................37LSIoscillatorcharacteristics..........................................................................................................37Low-powermodewakeuptimings.................................................................................................38PLLcharacteristics..........................................................................................................................38Flashmemorycharacteristics........................................................................................................39Flashmemoryenduranceanddataretention..............................................................................39EMScharacteristics.........................................................................................................................40EMIcharacteristics..........................................................................................................................41ESDabsolutemaximumratings....................................................................................................42Electricalsensitivities......................................................................................................................42I/Ostaticcharacteristics..................................................................................................................43Outputvoltagecharacteristics........................................................................................................45I/OACcharacteristics.....................................................................................................................46NRSTpincharacteristics................................................................................................................47TIMxcharacteristics.........................................................................................................................48I2Ccharacteristics............................................................................................................................49SCLfrequency(fPCLK1=36MHz.,VDD=3.3V)..........................................................................50SPIcharacteristics...........................................................................................................................51USBDCelectricalcharacteristics..................................................................................................53USB:Fullspeedelectricalcharacteristics....................................................................................54ADCcharacteristics.........................................................................................................................54ADCaccuracy(fPCLK2=14MHz,fADC=14MHz,RAIN<10k?,VDDA=3.3V)....................55TScharacteristics............................................................................................................................58LFBGA100-lowprofilefinepitchballgridarraypackagemechanicaldata...........................59LQFP100?100-pinlow-profilequadflatpackagemechanicaldata........................................61LQFP64?64pinlow-profilequadflatpackagemechanicaldata............................................62LQFP48?48pinlow-profilequadflatpackagemechanicaldata............................................63Thermalcharacteristics...................................................................................................................64Ordercodes......................................................................................................................................65https://houcheng-power.taobao.com4/67www.st.comSTM32FEBKxxListoffiguresListoffiguresFigure1.Figure2.Figure3.Figure4.Figure5.Figure6.Figure7.Figure8.Figure9.Figure10.Figure11.Figure12.Figure13.Figure14.Figure15.Figure16.Figure17.Figure18.Figure19.Figure20.Figure21.Figure22.Figure23.Figure24.Figure25.Figure26.Figure27.Figure28.Figure29.Figure30.Figure31.STM32FEBKxxperformancelineblockdiagram.........................................................................14STM32FEBKxxperformancelineLQFP100pinout.....................................................................15STM32FEBKxxperformancelineLQFP64pinout.......................................................................16STM32FEBKxxperformancelineLQFP48pinout......................................................................16STM32FEBKxxperformancelineBGA100ballout......................................................................17Memorymap.....................................................................................................................................22Pinloadingconditions......................................................................................................................24Pininputvoltage...............................................................................................................................24Powersupplyscheme......................................................................................................................24Currentconsumptionmeasurementscheme...............................................................................25High-speedexternalclocksourceACtimingdiagram................................................................34Low-speedexternalclocksourceACtimingdiagram.................................................................34Typicalapplicationwitha8-MHzcrystal.......................................................................................35Typicalapplicationwitha32.768kHzcrystal..............................................................................36UnusedI/Opinconnection..............................................................................................................44I/OACcharacteristicsdefinition.....................................................................................................47RecommendedNRSTpinprotection.............................................................................................48I2CbusACwaveformsandmeasurementcircuit........................................................................50SPItimingdiagram-slavemodeandCPHA=0........................................................................52SPItimingdiagram-slavemodeandCPHA=11).....................................................................52SPItimingdiagram-mastermode................................................................................................53USBtimings:definitionofdatasignalriseandfalltime..............................................................54ADCaccuracycharacteristics.........................................................................................................56TypicalconnectiondiagramusingtheADC.................................................................................56Powersupplyandreferencedecoupling(VREF+notconnectedtoVDDA)...............................57Powersupplyandreferencedecoupling(VREF+connectedtoVDDA)......................................57LFBGA100-lowprofilefinepitchballgridarraypackageoutline............................................59RecommendedPCBdesignrules(0.80/0.75mmpitchBGA)...................................................60LQFP100?100-pinlow-profilequadflatpackageoutline.........................................................61LQFP64?64pinlow-profilequadflatpackageoutline..............................................................62LQFP48?48pinlow-profilequadflatpackageoutline..............................................................63https://houcheng-power.taobao.comwww.st.com5/67