objective evidence.
无尘室的温度，湿度，尘埃粒子是否管控良好，其符合10K最高要求，并且，超过规格时有相应通知？审核客观证据。\
\alarms for out of control notification?
无尘室压力是否管控良好并且当超过管控范围时有报警系统？\
\controlled in designate area?
所有制程WIP与材料是否有相应的定义并管控在指定的区域？\
\the resist lamination and exposure areas in the cleanroom utilizing yellow lighting and do all exterior windows have UV blocking film? 无尘室的压膜与曝光区是否用的是黄灯并且所有的外部窗户使用的是UV膜？\\liquid resist are stored in temperature and humidity control environment? Also, inventoried under FIFO with expired date control?
是否能够证明所有的干膜/或湿膜均管控在相应的温度/湿度范围之内？ 并且，有先进先出过期日期管控目录？\
\verified using the infrared meter at the entrance to the dry film laminator? 是否在进行干膜压膜时，对PCB温度/压合滚轮进行红外线确认？\
\documented pass/fail criteria? (eg, bubble, tension force)
干膜压膜是否有规定的检验标准以判定PASS/Fail？（例如：气泡，张力）\\fully exposed before resist removal i.e. stripped?
压膜或涂布制程在去膜前的不良板是否在去膜前（例如：剥膜）完全曝光？\\the artwork cleaned after defined exposure times using tacky roller? Review the condition of the tacky rollers.
在确定曝光次数后是否使用粘尘滚轮对底片进行清洁？审核清洁滚轮状况？\\exposing the remainder of the lot? Is the front to back verified during this process?
在批量之前，是否对外层显影或AOI进行首件确认？此制程是否校准上下对准度？\
\是否测试并管控层间上下对准度？\
\the maximum number of permissible exposures documented with a system to track the number of exposures?
可允许的最大曝光次数是否有文件规定并有系统对曝光次数进行跟踪？\
\exposures have been reached?
当底片达到最大曝光次数后是否隔离并处理掉 ？\
\followed?
曝光与显影之间的静置时间是否有文件规定并有按照其要求执行？\\current(completely filled in)?
显影线是否有启动前有点检表？目前是否已经执行（完整的填写）？\
\a first article run prior to developing the lot to confirm developer settings and linewidths?
是否在批量显影前做首件以确认显影设备与线径？\
\rinse flow rates and are these verified by conductivity measurements? 是否有文件规定最大最终水洗污染水准，水流率与传导性测试？\\the panels observed coming off the developer line clean, dry and stain free?
显影线后是否对板面检查清洁度，干燥度，与无污染度？\
\there a system in place to identify the linewidths to be measured on a panel?
现场是否有系统对板面线径进行测量？\
\所有的修补板是否有规定并可以追踪？\
\photoresist before copper plating
是否有文件规定干膜压膜到镀铜之间的最大静置时间？\Subsection scores部分得分
Section 11 - AOI of Outerlayer 外层AOI
\外层是否100%进行AOI？若没有，抽样频率是多少？\
\controlled in designate area?
所有在制品WIP与材料是否有定义并管控在指定的区域？\
\with repeat defects?
当影像转移区首件重复发现不良时是否有通知系统？\
\stations and defect data collected and reported in a meaningful manner? AOI不良确认是否有独立的确认站，收集不良数量并进行有意义的报告？\
\there a documented procedure identifing the maximum number of repairs allowed, including but not limited too welding opens, cutting out shorts and excess copper spots, etc?
是否有文件规定允许修补的最大次数，包括但不限于OPEN焊接，处理短路或残铜等？\
\a MRB team?
是否设置不良數量限定，以使MRB小组审核？\
\repaired panels re-AOI to confirm all defects were found and repaired?
修补的板子是否重新过AOI以确认所有的不良是否已经找到并修补？\\修补的板子是否可以确定其跟踪性？\
\improvement team established? Are first pass yield and final yield targets defined?
AOI站生产率是否每天进行跟踪ing反馈给建立的品质改善小组？是否对直通率与最终达成率进行定义？\
\若生产率低于目标是否采取改善措施？\
\golden boards used to check the AOI machine before the inspection of each shift?
在每次换班前是否用AOI机器检验镀金板？\
\continuous improvement used to eliminate top defects?
针对已经确定的最高不良项目是否有柏拉图进行分析？是否使用有效的改善对策以减少不良？\
\welds? For Synaptics product is this procedure defined based on IPC-7721 ? 重工指导书是否规定焊接条件与焊接次数？Synaptics产品是否根据IPC-7721定义？\
\traces to ensure the reliability of repair? Is there any controlled for the number of welds?
是否对焊接处进行胶带测试或阻抗测试以确保修补后的信赖性？焊接次数是否有管控？\
Subsection scores部分得分
Section 12 - Plating 电镀 \there a pre-startup checklist for the electrolytic copper plating line? Is it current(completely filled in)?
电镀制程启动是否有点检表？是否已经执行（完整的填写）？\
\
traveler? What is the ASF range used during plating? Who determines ASF? How?
电镀电流与程序是否符合设计要求？电镀时的ASF范围是多少？谁确定ASF？如何确认？\\the copper plating process an electrolytic acid copper plating system? 电镀站是否有酸解电镀铜系统？\
\plating product?
在电镀前是否作为启动程序执行试镀？\
\controlled in designate area?
所有在制品WIP与材料是否有相应的定义并管控在指定的区域？\\化学药水是否使用DI水？\
\maintenance? Is it current?
是否建立阳极，电镀条鱼电缆的维护计划？是否已经运行？\
\the filter bag cleaned and checked periodically to ensure no plugging and broken?
是否定期对过滤袋进行清洁与检验以确保无堵塞于破损？\
\frequency of treating each plating tank every six months?
是否建立碳处理计划并确定其频率最大为每个电镀槽每6个月进行一次？\\followed by a closed loop corrective action?
是否通过切片检验PTH与小导通孔孔壁状况，并有相应的改善对策跟踪？\
\and other quality documents? 铜厚是否有规定的规范？\
\size data to insure the hole sizes are centered on nominal and have a good Cpk?
前工程提供的孔径是否有相应的反馈跟踪以确保孔径的中心值正常并有很好的CPK？\\plating distributions performed each plating tank on a monthly basis? 每个电镀槽是否每月进行药水添加？\
\thermal stressed cross-sections performed as an in-process plating control?
制程电镀管控是否有热应力切片试验？\
\there an evidence that expiration date of all wet materials are well controlled?
是否能证明所有的潮湿材料的过期日期有很好的管控？\
\conducted on periodic basis that meets the requirements in SYNA specification?
是否能证明孔德信赖性测试由定期执行以符合syna规范要求？\
\quality checks?
是否有文件规定可以重工的程序与相应的品质检验要求？\
\does the reworked product receive appropriate re-inspection and testing? 若产品重工，是否有相应的重工文件并且重工品有接受相应的再次检验与测试？\
\objective evidence exist that they are being adhered too?
报废与重工计划是否规定要求有 剥膜-蚀刻-剥膜的客观证据？\
\it used to validate correct equipment setup?
是否有喷嘴设计图/转运计划并且其用于改善设备布局？\
\controlled in designate area?
所有在制品WIP与材料是否有相应的定义并管控在指定区域？\
\the filtration system adequate? What's the clean frequency and renew frequency?
过滤系统是否完善？其清洁频率与更新频率是多少？\\a first article run prior to etching the lot to confirm etcher settings and linewidths?
在批量蚀刻前是否进行首件与确认蚀刻机设备与线径？\
\rinse flow rates and are these verified by conductivity measurements? 是否有文件规定最大水洗污染水准？\
\每片板之间是否有分隔胶片以避免刮伤？\
\there a system in place to identify the linewidths to be measured on a panel?
是否有系统要求对线径的测量进行定义？\
\SMT PAD 是否测试其节距并适用SPC进行管控？\\the panels observed coming off the SES line clean, dry and stain free? 板子从SES线下来后，是否检验清洁度，烘干度与无污染？\Subsection scores部分得分
Section 13 - Gold Plating 镀金
\current(completely filled in)?
前处理线是否有启动点检表？是否已经运行（完整的填写）？\
\analyzed by the laboratory on the documented frequency?
是否能证明前处理化学药水有被化验室按照文件要求的频率进行分析？\\controlled in designate area?
所有的在制品WIP与材料是否有相应的定义并管控在指定区域？\
\there a documented process for select the plating current or program to match the different Gold and Nickel thickness? 是否有文件规定电镀电流或要求符合不同的电镀金厚？\
\在每班转班前是否检查喷嘴？\
\there an evidence to demonstrate that the PCB surface cleanliness is monitored and controlled? Water break test?