calibration records exist?
镍槽是否有自动控制器并且有控制器校准记录？\
\documented recoating schedule?
挂架/篮子镀层是否良好？是否有文件规定重新电镀的计划？\
\there a documented quality conformance procedure with accept/reject criteria for gold finger plating line malfuctions(chemistries out of spec. time, temperature, etc. interuptions) to insure the quality of the product in the plating line?
是否有文件规定的合格品程序作为镀金线的接受/判退标准。（化学药水，时间，温度等）是否确保电镀线的产品品质？\
\化镍金是否可以重工？若可以，是如何重工？\
\针对每批电镀附着力，是否使用IPC胶带测试？\
\the customer specific ENIG thickness requirements documented on the traveler?
是否有文件规定按照客人规定的化镍金厚度进行管控？\\the XRF calibration records current and are appropriate XRF standards used to verify calibration?
目前是否有XRF校准记录于接近XRF标准的方法用于确认精确度？\
\X-ray measurement for Au/Ni/ thickness performed on every production rack?
是否针对每个挂架产品要求使用XR测试镍金厚度？\\the deposition rates microinches/minute for the nickel & gold plating calculated and confirmed to meet the chemical supplier's recommended deposition rate each shift?
镍金电镀沉积率的统计方法是否为microinches/分，并每班对沉积率进行确认以与化学药水供应商建议的一致？\
\evaluate surface and hole solderability per IPC 6012 class 2 requirements? 焊锡性测试是否根据J-STD-003，第2章标准评估表面状况，根据IPC 6012 2级水准要求确认孔状况 ？\
\the solderability test frequency being performed at a minimum of once per lot?
焊锡性测试最小测试频率是否为每批一次？\
\studied and findings implemented? Idenify black pad precautions taken. 镍金腐蚀/剥离是否相互影响？是否PAD发黑有预警？\
\monitored?
关键制程参数是否有要求用SPC与CPK值管控？\
\there a documented shutdown procedure for the entire plating line(s) that includes the critical steps for the nickel plating bath(temperature
& nickel controller flushing)?
整个电镀线是否有停线程序，包括镀金槽的关键步骤（温度/湿度管控）？\Subsection scores部分得分
Section 17 - Electrical Test 电测
\passed and failed boards:
所有的板子在测试后是否有简单的区别方式以避免PASS/FAILED的板子相互混料？\
\温度/湿度是否管控在最优的测试条件下？\
\controlled in designate area?
所有在制品WIP与材料是否有相应的定义并管控在指定的区域？\
\the test fixture passed the incoming inspection before they are used? 在使用之前，治具是否通过了进料检验？\
\the tools and fixtures associated with P/N and REV clearly identified? 治具是否与料号/版本一致？\
\OPEN/SHORT测试机器是否接地？\
\testing machine having self-check function before each shift machine start-up?
每次换机器前，机器是否有自我检验功能？\
\there procedure in place that clearly defines the ET fixture set up? Is there objective evidence that it is followed?
现场是否有程序明确规定EI证据的装配？是否有客观证据？\
\每次换班前是否对治具进行检验？\
\Debug performed in an isolated area to avoid mixing passed and failed boards?
是否有单独的除错区域避免PASS/FAILED板子混料？\\确认后是否对板子再次进行测试？\
\repaired PCB's subjected to a complete electrical test after repair? 修补后的板子是否再次进行电测？\
\the PCBs properly identified by their P/N, status, and traceability information?
是否对PCB的料号，状况，可跟踪性进行确认？\
\all passed/rejected boards properly labeled and segregated to avoid mixing or missing?
所有的PASS/REJECTED板是否有相应的标签并单独放置以避免混料？\
\there documented electrical test parameters in the Electrical Test area? Including the carbon ink resistance?
是否有文件规定电测工作区的相关参数，包括碳墨阻抗？\
\the open and short repair procedures documented and operators trained and certified?
是否有程序规定OPEN/SHORT修补并且作业员有受到培训并得到承认？\\trace repair, is the trace width under 5mil are not allowed for repair? 针对线路修补，是否有要求线径低于5mil的不允许修补？\\是否根据IPC规格对焊接修补进行胶带测试？\
\the maximum number of repairs per Synaptics Specification documented in the Repair Area and is there objective evidence that it is being adhered too?
是否按照synaptics规范定义最大修补次数，并有证据证明有按照此执行？\\coated on the PCB?
修一/修补是否使用与PCB原印刷相同的S/M材料？\
\是否按照IPC规格对防焊进行修补？\
\there documentation that identifies that can and cannot be repaired? Synaptics does not permit repair of carbon ink lines.
是否有文件规定某些不良不良修补？Synaptics不允许修补碳墨线？\\是否对烤箱进行校准？\
\PASS的板子是否有相应的电测标记？\
\是否对电测设备性能定期进行评估？\Subsection scores部分得分
Section 18 - Final Inspection 最终检验
%understood in the inspection area?
是否可以轻松，简单，明确的在检验区查阅到客人的规范？\
\microscopes (10X min)?
检验站是否有放大镜或立式显微镜（最小10倍）？\
\stations?
检验区灯光是否充足？\
\the final QC inspectors have access to 30X + magnification or greater for defect verification?
最终Qc检验是否有用30倍或更多倍的放大镜以确认不良？\
\controlled in designate area?
所有在制品WIP与材料是否有相应的定义并管控在指定的区域？\\
最终QC人员是否能了解相关的工艺标准？\
\inspectors handling the board properly to avoid damage or mixing? 现场是否有标准作业程序？作业员操作是否合适以避免损坏或混料？\
\there a nonconforming procedure that clearly define the disposition of nonconforming boards? Are the nonconforming boards segregated properly? 是否有清楚明确的定义不合格品程序？不合格品是否隔离处理？\
\inspection escapes to the customer for each inspector? If the inspectors performance is poor, is there any re-training or job transition?
是否有规定系统跟踪状况，例如：检验编号以避免检验人员漏检？若检验人员检验能力不好，是否有进行再次培训或转换工作？\
\inspection records for a given part number?
针对之前的品质问题和客户强烈抱怨的料号，是否有其检验记录？\\是否对判退数据作柏拉图分析？\
\coated on the PCB?
修一/修补是否使用与PCB原印刷相同的S/M材料？\
\checked by final QC inspectors?
所有制程和最终检验重工品和修补品是否有最终品质检验人员检验？\\是否有按照文件要求作出FAI报告？\\soldermask touchups adhesion tape tested IPC-TM-650, Method 2.4.28.1? 防焊修补是否根据IPC-TM-650，2.4.28.1方法用胶带测试其附着力？\Subsection scores部分得分
Section 19 - Laboratory 实验室
\methods adhered too for microsection evaluations?
是否有规定IPC规格，建立程序与方法，进行切片效果确认？\
\there a documented system for Synaptics PCB fab drawing requirements (dielectric thickness, copper weights, surface copper, plating thickness, etc.) for microsection verification? 是否有文件规定synaptics PCB的要求（电解厚度，铜箔厚度，铜箔表面，电镀厚度等）进行切片确认？\
\Process Engineering and Operations for microsection failures?
是否当作业员发现切片试验不良时，有正式的系统反馈给前工程，生技？\
\structural integrity microsection coupons prepared per IPC-TM-650, Method 2.1.1 or 2.1.1.2 with acceptability verified per IPC-6012, Class 2?
是否根据IPC-TM-650，2.1.1方法对切片取样或根据2.1.2.2 IPC-6012.2级水准对其接受标准进行判定？\
\structural integrity microsection performed at the rate of at least two per lot for FAI and one per date code for mass production? 是否有对切片规定至少按照FAI要求每批测试两个切片或量产时，至少每个周期做一个？\
\IPC-TM-650, Method 2.6.8 and microsectioned per IPC-TM-650, Method 2.1.1.2 with acceptability verified per IPC-6012, Class 2?
是否根据IPC-TM-650 2.6.8方法对热应力取样并根据IPC-TM-650，2.1.1.2方法取切片样品并依IPC-6012.2级水准对其接受标准进行判定？\
\是否通过1倍或3倍对热应力进行确认？\
\thermal stressed microsection performed at the rate of at least one coupon per one production lot?
热应力切片试验是否每批测试一个样本？\
\the temperature verified on the solder pot before coupons are thermal stressed?
在热应力测试之前是否确认锡炉的温度？\
\the microscope measurement system validated against a standard daily before microsection measurements? 在显微镜测试之前是否确认其有效？\
\a Gage R & R been performed on the microsection measurement system? 切片测试系统是否使用GAGE R/R?\
\system for locating archived microsections?
所有的切片是否至少保留一年，并且有存档系统并附有目录？\
\manufacturing lots and shipping lots?
存档的切片样品和文件可以追踪到生产批号与出货批号？\
\plating adhesion tests performed per IPC-6012, Class 2 Section 3.3.7 ? 根据IPC-6012，2级标号尊3.3.7执行电镀附着性测试？\
\J-STD-003, Category 2?
是否根据IPC-6012，2级标准与J-STD-003，D方法，第2章执行焊锡性测试？\\焊锡性样品是否至少保留一年？\
\there a documented analytical sampling plan with a closed loop system to insure that all chemical analysis are performed per either the laboratory procedure or manufacturing SOP?
是否有文件规定抽样计划并有按照其要求执行以确保所有的化学药水有按照实验室程序或生产SOP执行？\
\limits to prevent chemistries from going outside the specification limits