PCB行业现场稽查要点(4)

2019-02-20 23:16

是否能证明PCB表面清洁状况有进行监控与管控?是否有水不良测试?\

\a first article setup panel run to confirm process parameter to insure meeting nickel and gold thickness and other quality parameters before processing the remainder of the lot? 在开始量产前是否运作首件以确保制程参数,保证其符合镍和金厚等其他品质参数?\

\there a documented quality conformance procedure with accept/reject criteria for gold plating line malfuctions(chemistries out of spec. time, temperature, etc. interuptions) to insure the quality of the product in the plating line?

是否有品质合格品程序文件规定镀金板的接受与判退标准。(化学药水,时间,温度等超出规格),以确保电镀线品质标准?\

\the traveler or other process documentation specify the Nickel/Gold thickness ?

是否有文件规定镍金厚度?\

\quality checks?

是否有文件规定允许的重工程序和相应的品质检验?\

\是否用胶带测试确保镀金的附着力?\

\X-ray measurement used to measure Au/Ni thickness measurement ,If not what measurement?

是否适用X-RAY测量镍/金厚度,若没有,用什么进行测试?\\碳处理之间的时间是多长?\

\是否对板子进行多个孔测试以确保镀金板很好的沉积?\Subsection scores 部分得分

Section 14 - Solder Mask 防焊

\current(completely filled in)?

前处理线是否有开机点检表?其是否已经运行(完整的填写)?\

\there objective evidence that the precleaning chemistries are being analyzed by the laboratory at the documented frequency?

是否有客观证据说明前处理化学药水有被化验室按照文件规定的程序进行分析?\

\the soldermask preclean process being run per the current procedure, i.e. the speed, chemical concentration?

防焊前处理是否按照程序进行运行,即,速度,化学药水污染?\

\板子在热风烘干后是否完全烘干(例如,孔)?\

\controlled in designate area?

所有的在制品WIP与材料是否有相应的定义并管控在指定区域?\

\entrance into the cleanroom?

在前处理线进口的无尘室到无尘室是否有很好的空气压力?\

\current(completely filled in)?

是否有防焊涂布机的开机点检表?是否已经运行(填写完整)?\

\stack?

板子是否可以一片一片通过而无堆叠?\

\controlled in designate area?

所有在制品WIP与材料是否有相应的定义并管控在指定区域?\

\the viscosity of the solder mask after preparation checked to ensure the quality?

在检验前是否测试防焊的粘性以确保品质?\

\specified on its container?

在准备相应的容器前是否确认防焊油墨有没有过期?\

\temperature and humidity control environment? Also, inventoried under FIFO with expired date control?

是否能证明所有的防焊油墨储存在温湿度管控的环境内?另外,是否有先进先出及过期管控目录?\

\documented procedure?

防焊涂布机是否按照文件规定进行清洁与维护?\

\soldermask screen printers are used, is the silk-screen stencil life cycle controlled?

是否使用防焊网版印刷,并对网版适用寿命进行管控?\\是否每次在使用之前检查网版张力?\

\quality checks?

是否有文件规定重工程序及其相应的品质检验?\

\schedule? Is there objective evidence that it is being performed? 是否按照文件规定计划进行烤箱热循环测试?是否有客观证据其有执行?\\current(completely filled in)?

是否在曝光机开启前有点检表?是否已经运行(填写完整)?\

\there appropriate verification of the artwork before use to check for damage, eg AOI?

在底片开始使用前是否有相应的确认并检查其有无损坏,例如,使用AOI检验?\

\there inspection criteria applied for S/M with documented pass/fail criteria?

S/M是否有规定的相应检验标准以判定PASS/FAIL标准?\

\with the maximum number of reworks identified?

是否有文件规定涂布或曝光S/M 剥膜/重工程序定义其最大重工次数?\

\there a documented process for requesting compensated S/M artwork for registration problems?

是否有文件规定S/M底片对准度补偿要求问题?\

\quality checks?

是否有文件规定允许重工程序并有相应的品质检验?\

\consistent scaling?

底片是否储存在相应的地方以避免损坏,从而保证其精确度?\

\followed?

是否有文件规定曝光和显影之间最大的静置时间并有按照此要求执行?\\current(completely filled in)?

显影线是否有启动点检表?是否已经运行(完整的填写)?\\the panels observed coming off the developer line clean, dry and stain free?

显影线后的板子是否检验其清洁度,干燥度与无污染?\

\controls and traceability?

S/M 剥膜/重工是否有文件规定程序并有相应的品质管控和跟踪?\\防焊厚度效果是否进行监控?如何监控?\\a S/M cure monitored on a routine/documented procedure? Does objective evidence exist?

S/M固化是否有按照文件要求进行监控?是否有客观证据?\

\requirements in the Spec ? (e.g. adhesion, thickness, etc) 固化后是否有最终检验以确认是否在要求的规格内?(例如:附着力,厚度,等)\

\coated on the PCB?

修一/修补是否使用与PCB原本涂布相同材质的S/M?\

\tack dry/final cure ovens cleaned & calibrated as part of the routine maintenance?

烘干/最终固化烤箱是否定作为维护的一部分定期清洁/校准?\

\that it mets documented requirements?

准备后是否检验碳墨的粘性以确保符合文件规定的要求?\

\environment? Also, inventoried under FIFO with expired date control? 所有的碳墨是否储存在管控的温度/湿度环境内?并且有到期日起先进先出管控目录?\

\specified on its container?

碳墨的有效日期是否有標示在容器外?\

\ventilation?

网印清洁是否在通风清洁的环境内完成?\

\visible when the stencil is in its racks or mounted in the printer 所有的网版是否有贴标签或在网版放入架子与安装在印刷机上可以识别?\\there a documented requirement to inspect a stencil after it is cleaned? 网版清洁后是否有文件要求进行检验?\Subsection scores 部分得分

Section 15 - Rounting / Punching 捞边/冲床

\在开始量产前是否检验捞边程序?\

\捞边时板子是否有用固定PIN?\

\controlled in designate area?

所有在制品WIP与材料是否有相应的定义并管控在指定的区域?\

\first article dimension checked on the bottom panel from each spindle before production start-up and on each subsequent rout machine / punching machine setup?

在开始量产前是否按照机器顺序/冲床对每个轴的最下面的板子检测其首件尺寸?\

\stack height controlled properly based on pinning and abrasive used? 是否根据PIN与研磨状况管控相应的堆叠高度?\

\there evidence to demonstrate that all routing bits, Punching tools, V-cut/Beveller knives are well controlled? Such as the life control? 是否有征募证明所有的捞边钻咀,冲床,V-CUT/刀片有很好的管控?例如,使用寿命管控?\

\inspection station under document control?

PCB机械尺寸规格是否按照文件要求在检验站进行管控?\

\are well controlled?

是否有证据证明V-CUT深度和板尺寸有被很好的管控?\

\there process documentation in place to identify Synaptics's V-groove requirements? Is it verified during setup and lot inspection

现场是否有文件规定synaptics 的V-CUT槽要求?在设计和批量检验时,是否进行确认?\

\output boards at the bottom of each spindle inspected the dimension? 每轴最下面的板子的板子是否检验尺寸?\

\在开始量产前是否检验冲床?\Subsection scores 部分得分

Section 16 - ENIG 化镍金 \the ENIG chemical supplier audited and approved process. Provide date of last audit?

化镍金化学药水供应商是否稽核并承认制程?提供上次稽核的资料?\\current(completely filled in)?

电镀线启动时,是否有点检表?是否已经运行(完整的填写)?\

\the laboratory on the documented frequency?

是否有客观证据证明实验室有按照文件规定的频率对化学药水进行分析?\\controlled in designate area?

所有在制品WIP与材料是否有相应的定义并管控在指定的区域?\

\bath levels, temperatures, agitation, and rinses performed every two hours?

生产时,是否对管控器,水泵,槽液水准,温度,胶东,与水洗等每2小时进行一次确认?\

\the chemical controls based on the process chemistry suppliers TDS? 是否根据化学药水供应商TDS对化学药水进行管控?\

\Does objective evidence exist?

在倾倒之前是否有文件规定最大的镍/金槽更槽频率?是否有相关证据?\\confirm process parameter to insure meeting nickel and gold thickness and other quality parameters?

是否进行收监检验以确认制程上第一个蓝或挂架参数以确保符合镍金厚度或其它品质要求?\

\the maximum idle time at temperature established for the plating line? 电镀线是否规定最大的保持温度时间?\

\是否每天对微蚀进行监控?\

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