Dicyandiamide(Dicy)双氰胺. Die 冲模.
Die Attach晶粒安装. Die Bonding晶粒接着. Die Stamping冲压. Dielectric 介质.
Dielectric Breakdown Voltage介质崩溃电压. Dielectric Constant介质常数. Dielectric Strength介质强度.
Differential Scanning Calorimetry(DSC)微差扫瞄热卡分析法. Diffusion Layer扩散层. Digitizing数字化. Dihedral Angle双反斜角. Dimensional Stability尺度安定性. Diode二极管. Dip Coating浸涂法. Dip Soldering浸焊法.
DIP(Dual Inline Package)双排脚封装体. Dipole偶极,双极.
Direct / Indirect Stencil直接/间接版膜. Direct Emulsion直接乳胶. Direct Plating直接电镀. Discrete Compenent散装零件.
Discrete Wiring Board散线电路板,复线板. Dish Down碟型下陷. Dispersant分散剂.
Dissipation Factor散失因素. Disspation Factor散逸因子. Disturbed Joint受扰焊点. Doctor Blade修平刀,刮平刀. Dog Ear狗耳. Doping掺杂. Double Layer双电层.
Double Treated Foil双面处理铜箔. Drag In / Drag Out带[进/带出. Drag Soldering拖焊. Drawbridging吊桥效应. Drift漂移.
Drill Facet钻尖切削面. Drill Pointer钻针重磨机. Drilled Blank已钻孔的裸板. Dross浮渣.
Drum Side铜箔光面. Dry Film干膜.
Dual Wave Soldering 双波焊接. Ductility展性. Dummy Land假焊垫. Dummy, Dummying假镀(片). Durometer橡胶硬度计. DYCOstrate电浆蚀孔增层法. Dynamic Flex(FPC)动态软板. *****E***** E-Beam (Electron Beam)电子束. Eddy Current涡电流. Edge Spacing板边空地.
Edge-Board Connector板边(金手指)承接器. Edge-Board Contact板边金手指.
Edge-Dip Solderability Test板边焊锡性测试. EDTA乙二胺四乙酸. Effluent排放物. E-glass电子级玻璃. Elastomer弹性体.
Electric Strength(耐)电性强度. Electrodeposition电镀.
Electro-deposition Photoresist电着光阻, 电泳光阻. Electroforming电铸.
Electroless-Deposition无电镀. Electrolytic Tough Pitch电解铜.. Electrolytic-Cleaning电解清洗. Electro-migration电迁移. Electro-phoresis电泳动, 电渗. Electro-tinning镀锡. Electro-Winning电解冶炼. Elongation 延伸性, 延伸率. Embossing凸出性压花.
EMF(Electromotive Force)电动势.
EMI(Electromagnetic Interference)电磁干扰. Emulsion乳化. Emulsion Side药膜面. Encapsulating胶囊. Encroachment沾污,侵犯. End Tap封头. Entek有机护铜处理. Entrapment夹杂物. Entry Material盖板. Epoxy Resin环氧树脂. Etch Factor蚀刻因子. Etchant蚀刻剂(液).
Etchback回蚀.
Etching Indicator蚀刻指针. Etching Resist蚀刻阻剂. Eutetic Composition共融组成. Exotherm放热(曲线). Exposure曝光. Eyelet铆眼.
*****F***** Fabric纲布.
Face Bonding反面朝下结合. Failure故障.
Fan Out Wiring/Fan In Wiring扇出布线/扇入布线. Farad 法拉. Farady法拉第.
Fatigue Strength抗疲劳强度. Fault缺陷. Fault Plane断层面. Feed Through Hole导通孔. Feeder 进料器.
Fiber Exposure玻纤显露. Fiducial Mark基准记号. Filament纤丝. Fill纬向. Filler填充料. Fillet内圆填角. Film底片.
Film Adhesive接着膜,粘合膜. Filter过滤器. Fine Line细线.
Fine Pitch密脚距,密线距,密垫距. Fineness粒度, 纯度. Finger手指. Finishing终修(饰).
Finite Element Method有限要素分析法. First Article首产品. First Pass-Yield初检良品率. Fixture夹具. Flair刃角变形. Flame Point自燃点. Flame Resistant耐燃性. Flammability Rate燃性等级. Flare扇形崩口. Flash Plating闪镀. Flashover闪络.
Flat Cable扁平排线. Flat Pack扁平封装(之零件). Flatness平坦度.
Flexible Printed Circuit (FPC)软板. Flexural Failure挠曲损坏.
Flexural Module弯曲模数, 抗挠性模数 . Flexural Strength抗挠强度. Flip Chip覆晶,扣晶. Flocculation絮凝.
Flood Stroke Print覆墨冲程印刷. Flow Soldering (Wave Soldering)流焊. Fluorescence荧光.
Flurocarbon Resin碳氟树脂.
Flush Conductor嵌入式线路 , 贴平式 导体. Flush Point闪火点. Flute退屑槽. Flux助焊剂. Foil Burr铜箔毛边. Foil Lamination铜箔压板法. Foot残足(干膜残余物). Foot Print (Land Pattern)脚垫. Foreign Material 外来物,异物. Form-to-List布线说明清单. Four Point Twisting四点扭曲法. Free Radical自由基. Freeboard干舷. Frequency频率. Frit 玻璃熔料.
Fully-Additive Process全加成法. Fungus Resistance抗霉性. Fused Coating熔锡层. Fusing熔合. Fusing Fluid助熔液.
*****G***** G-10由连续玻纤所织成的玻纤布与 环氧树脂粘结剂所复合成的材料. Gage, Gauge量规.
Gallium Arsenide (GaAs)砷化镓.
Galvanic Corrosion贾凡尼式腐蚀(电解式腐蚀). Galvanic Series贾凡尼次序(电动次序). Galvanizing镀锌.
GAP第一面分离,长刃断开. Gate Array闸列,闸极数组. Gel Time胶化时间.
Gelation Particle胶凝点.
Gerber Data ,Gerber File格博档案(是美商Gerber公司专为PCB面线路 图形与孔位,所发展一系列完整的软件档案). Ghost Image阴影.
Gilding镀金 (现为:Glod Plating). Glass Fiber玻纤.
Glass Fiber Protrusion/Gouging, Groove玻纤突出/挖破. Glass Transition Temperature, Tg玻璃态转化温度. Glaze釉面,釉料. Glob Top圆顶封装体. Glouble Test球状测试法. Glycol (Ethylene Glycol)乙二醇. Golden Board测试用标准板. Grain Size结晶粒度. Grass Leak 大漏. Grid标准格.
Ground Plane /Earth Plane接地层. Ground Plane Clearance接地空环. Guide Pin导针.
Gull /Wing Lead鸥翼引脚. *****H***** Halation环晕. Half Angle半角. Halide卤化物. Haloing白圈,白边.
Halon海龙,是CFC\氟碳化物\的一种商品名. Hard Anodizing硬阳极化. Hard Chrome Plating镀硬铬. Hard Soldering硬焊.
Hardener (Curing Agent)硬化剂(或Curing Agent). Hardness硬度.
Haring-Blum Cell海固槽. Harness电缆组合. Hay Wire跳线. Heat Cleaning烧洁. Heat Dissipation散热.
Heat Distortion Point (Temp)热变形点(温度). Heat Sealing热封. Heat Sink Plane散热层. Heat Transfer Paste导热膏. Heatsink Tool散热工具. Hertz(Hz)赫.
High Efficiency Particulate Air Filter (HEPA)高效空气尘粒过泸机. Hipot Test 高压电测.