Omega Meter离子污染检测仪. Omega Wave振荡波.
On-Contact Printing密贴式印刷. Opaquer不透明剂,遮光剂. Open Circuits断线.
Optical Comparater光学对比器(光学放大器.) Optical Density光密度. Optical Inspection光学检验. Optical Instrument光学仪器.
Organic Solderability Preservatives (OSP)有机保焊剂. Osmosis渗透. Outgassing出气,吹气. Outgrowth悬出,横出,侧出. Output产出,输出. Overflow溢流. Overhang总悬空. Overlap 钻尖点分离.
Overpotantial(Over voltage)过电位,过电压. Oxidation氧化.
Oxygen Inhibitor氧化抑制剂. Ozone Depletion臭氧层耗损. *****P***** Packaging封装,构装. Pad焊垫,圆垫. Pad Master圆垫底片. Pads Only Board唯垫板. Palladium钯. Panel制程板.
Panel Plating全板镀铜. Panel Process全板电镀法.
Paper Phenolic纸质酚醛树脂(板材). Parting Agent脱膜剂. Passivation钝化 ,钝化外理.
Passive Device (Component)被动组件(零件) Paste膏,糊. Pattern板面图形. Pattern Plating线路电镀. Pattern Process线路电镀法. Peak Voltage峰值电压. Peel Strength抗撕强度.
Periodic Reverse (PR) Current周期性反电流. Peripheral周边附属设备. Permeability透气性,导磁率. Permittivity诱电率,透电率.
pH Value酸碱值. Phase相.
Phase Diagram相图. Phenolic酚醛树脂. Photofugitive感光褪色.
Photographic film感光成像之底片. Photoinitiator感光启始剂. Photomask光罩.
Photoplotter, Plotter光学绘图机. Photoresist光阻.
Photoresist Chemical Machinning (Milling)光阻式化学(铣刻)加工. Phototool底片.
Pick and Place拾取与放置. Piezoelectric压电性. Pin 插脚,插梢,插针.
Pin Grid Array (PGA)矩阵式针脚对装. Pinhole针孔. Pink Ring粉红圈. Pitch跨距,脚距,垫距,线距. Pits凹点. Plain Weave平织. Plasma电浆.
Plasticizers可塑剂,增塑剂. Plated Through Hole镀通孔. Platen热盘. Plating镀. Plotting标绘. Plowing犁沟. Plug插脚,塞柱. Ply层,股.
Pneumatic Stretcher气动拉伸器. Pogo Pin伸缩探针. Point 钻尖. Point Angle钻尖面.
Point Source Light点状光源.
Poise泊.\粘滞度\单位=1dyne*sec/cm2. Polar Solvent极性溶剂. Polarity电极性. Polarization分极,极化. Polarizing Slot偏槽. Polyester Films聚酯类薄片. Polymer Thick Film (PTF)厚膜糊. Polymerization聚合. Polymide(PI)聚亚醯胺.
Popcorn Effect爆米花效应. Porcelain瓷材,瓷面. Porosity Test疏孔度试验. Positive Acting Resist正性光阻剂. Post Cure后续硬化,后烤.
Post Separation后期分离,事后公离. Pot Life运用期,锅中寿命. Potting铸封,模封. Power Supply电源供应器. Preform 预制品. Preheat预热. Prepreg胶片,树脂片. Press Plate钢板.
Press-Fit Contact挤入式接触. Pressure Foot 压力脚. Pre-tinning预先沾锡. Primary Image线路成像. Print Through压透,过度挤压.. Probe探针.
Process Camera制程用照像机. Process Window操作范围. Production Master生产底片. Profile轮廓,部面图,升温曲线图棱线. Propagation传播.
Propagation Delay传播延迟. Puddle Effect水坑效应. Pull Away拉离.
Pulse Plating脉冲电镀法. Pumice Powder 浮石粉. Punch冲切.
Purge, Purging净空,净洗.
Purple Plague紫疫(金与铝的共化物层). Pyrolysis热裂解,高温分解. *****Q***** Quad Flat Pack (QFP)方扁形封装体. Qualification Agency资格认证机构. Qualification Inspection资格检验.
Qualified Products List合格产品(供应者)名单. Qualitative Analysis定性分析.
Quality Conformance Test Circuitry (Coupon)品质符合之试验线路(样板). Quantitative Analysis定量分析. Quench 淬火,骤冷. Quick Disconnect快速接头. Quill纬纱绕轴.
*****R***** Rack 挂架.
Radial Lead放射状引脚.
Radio Frequency Interference (RFI)射频干扰. Rake Angle抠角,耙角.
Rated Temperature, Voltage额定温度,额定电压. Reactance电抗.
Real Estate底材面,基板面. Real Time System 实时系统. Reclaiming再生,再制. Rediometer辐射计,光度计. Reel to Reel卷轮(盘)式操作. Reference Dimension参考尺度. Reference Edge参考边缘. Reflection反射.
Reflow Soldering重熔焊接,熔焊. Refraction折射. Refractive Index折射率. Register Mark对准用标记. Registration对准度. Reinforcement补强物. Rejection剔退,拒收.
Relamination(Re-Lam)多层板压合. Relaxation松弛.缓和. Relay继电器.
Release Agent, Release Sheets脱模剂,离模剂. Reliability可靠度,可信度. Relief Angle浮角. Repair修理.
Resin Coated Copper Foil背胶铜箔. Resin Content胶含量,树脂含量. Resin Flow胶流量,树脂流量. Resin Recession树脂下陷.
Resin Rich Area 多胶区,树脂丰富区. Resin Smear胶(糊)渣.
Resin Starve Area缺胶区,树脂缺乏区. Resist阻膜,阻剂.
Resistivity电阻系数,电阻率. Resistor电阻器,电阻. Resistor Drift电阻漂移. Resistor Paste电阻印膏. Resolution解像,解像度,分辨率. Resolving Power解析(像)力,分辨力. Reverse Current Cleaning反电流(电解)清洗.
Reverse Etchback反回蚀. Reverse Image负片影像(阻剂). Reverse Osmosis (RO)反(逆渗透). Reversion反转,还原. Revision修正版.改订版. Rework(ing)重工,再加工. Rhology流变学,流变性质. Ribbon Cable圆线缆带.
Rigid-Flex Printed Board硬软合板. Ring 套环. Rinsing水洗,冲洗.
Ripple纹波(指整流器所输出电流中不稳定成分). Rise Time上升时间.
Roadmap 线路与零件之布局图. Robber辅助阴极. Roller Coating辊轮涂布. Roller Coating滚动涂布法. Roller Cutter辊切机. Roller Tinning辊锡法,滚锡法. Rosin松香.
Rotary Dip Test摆动沾锡试验. Routing切外型. Runout偏转,累绩距差. Rupture迸裂.
*****S***** Sacrificial Protection牺牲性保护层. Salt Spray Test盐雾试验. Sand Blast喷砂. Saponification皂化作用. Saponifier皂化剂. Satin Finish缎面处理.
Scaled Flow Test比例流量实验. Schemetic Diagram电路概略图. ScoringV型刻槽. Scratch刮痕.
Screen Printing纲版印刷. Screenability纲印能力. Scrubber磨刷机,磨刷器. Scum透明残膜. Sealing封孔.
Secondary Side第二面 . Seeding下种.
Selective Plating选择性电镀. Self-Extinguishing自熄性.