Selvage布边.
Semi-Additive Process半加成制程. Semi-Conductor半导体. Sensitizing敏化.
Separable Component Part可分离式零件. Separator Plate隔板, 钢板.
Sequential Lamination接续性压合法. Sequestering Agent螯合剂. Shadowing阴影,回蚀死角. Shank钻针柄部.
Shear Strength 抗剪强度. Shelf Life储龄. Shield遮蔽.
Shore Hardness萧氏硬度. Short短路.
Shoulder Angle肩斜角. Shunt分路. Side Wall侧壁. Siemens电阻值.
Sigma (Standard Deviation)标准差. Signal讯号. Silane硅烷. Silica Gel硅胶砂. Silicon硅. Silicone硅铜.
Silk Screen纲版印刷,丝纲印刷. Silver Migration银迁移. Silver Paste 银膏.
Single-In-Line Package(SIP)单边插脚封装体. Sintering烧结. Sizing上胶,上浆. Sizing上浆处理.
Skin Effect集肤效应 (高频下,电流在传递时多集中在导体 表面,使得道线内部通过电流甚少, 造成内部导体 浪费,并也使得表面导体部分电阻升高. Skip Printing, Skip Plating漏印,漏镀. Skip Solder 缺锡, 漏焊. Slashing浆经. Sleeve Jint套接. Sliver边丝,边余. Slot, Slotting槽口. Sludge于泥. Slump塌散. Slurry稠浆,悬浮浆.
Small Hole小孔. Smear胶渣. Smudging锡点沾污. Snap-off弹回高度. Socket插座. Soft Contact轻触.
Soft Glass 软质玻璃(铅玻璃). Solder焊锡. Solder Ball锡球. Solder Bridging锡桥. Solder Bump 焊锡凸块.
Solder Column Package锡柱脚封装法. Solder Connection焊接. Solder Cost焊锡着层. Solder Dam锡堤. Solder Fillet填锡.
Solder Levelling喷锡,热风整平. Solder Masking(S/M)防焊膜绿漆. Solder Paste锡膏. Solder Plug锡塞(柱). Solder Preforms预焊料. Solder Projection焊锡突点. Solder Sag 焊锡垂流物. Solder Side焊锡面. Solder Spatter溅锡. Solder Splash贱锡.
Solder Spread Test散锡试验. Solder Webbing锡纲. Solder Webbing锡纲.
Solder Wicking渗锡,焊锡之灯芯效应. Solderability可焊性. Soldering软焊,焊接.
Soldering Fluid, Soldering Oil助焊液,护焊油. Solid Content固体含量,固形分. Solidus Line固相线. Spacing间距. Span跨距. Spark Over闪络. Specific Heat 比热.
Specification (Spec)规范,规格. Specimen样品,试样.
Spectrophotometry分光光度计检测法. Spindle主轴,钻轴. Spinning Coating自转涂布.
Splay斜钻孔.
Spray Coating喷着涂装. Spur底片图形边缘突出. Sputtering溅射. Squeege刮刀. Stagger Grid蹒跚格点.
Stalagometer滴管式表面张力计. Stand-off Terminals直立型端子. Starvation缺胶.
Static Eliminator静电消除器. Steel Rule Die(钢)刀模. Stencil版膜.
Step and Repeat逐次重复曝光. Step Plating梯阶式镀层. Step Tablet阶段式曝光表. Stiffener补强条(板). Stop Off防镀膜, 阻剂. Strain变形,应变.
Strand绞(指由许多股单丝集束并旋扭而成的丝束).
Stray Current迷走电流, 散杂电流(在电镀槽系统中,其直流电 由整流器所提供,应在阳极板与被镀件之间的汇 电杆与槽体液体中流通,但有时少部分电流也可能会 从槽体本身或加热器上迷走,漏失). Stress Corrosion应力腐蚀. Stress Relief消除应力. Strike预镀. Stringing拖尾. Stripline条线. Stripper剥除液(器). Substractive Process减成法. Substrate底材.
Supper Solder超级焊锡. Supported Hole(金属)支助通孔. Surface Energy表面能.
Surface Insulation Resistance表面绝缘电阻. Surface Mount Device 表面粘装组件.
Surface Mounting Technology (SMT)表面粘装技术. Surface Resistivity表面电阻率. Surface Speed钻针表面速度. Surface Tension表面张力. Surfactant表面润湿剂. Surge突流,突压.
Swaged Lead压扁式引脚. Swelling Agents, Sweller膨松剂.
Swimming 线路滑离. Synthetic Resin合成树脂. *****T***** Tab接点,金手指.
Taber Abraser泰伯磨试器. Tackiness粘着性, 粘手性.
Tape Automatic Bonding (TAB)卷带自动结合. Tape Casting 带状铸材. Tape Test撕胶带试验. Tape Up Master原始手贴片. Taped Components卷带式连载组件. Taper Pin Gauge锥状孔规. Tarnish污化. Tarnish 污化, 污着. Teflon铁氟龙(聚4氟乙烯). Telegraphing浮印,隐印. Temperature Profile温度曲线. Template模板.
Tensile Strength抗拉强度. Tensiomenter张力计. Tenting盖孔法. Terminal端子.
Terminal Clearance端子空环. Tetra-Etch氟树脂蚀粗剂. Tetrafunctional Resin四功能树脂.
Thermal Coefficient of Expansion (TCE)热膨胀系数. Thermal Conductivity导热率. Thermal Cycling热循环,热震荡. Thermal Mismstch感热失谐. Thermal Relief散热式镂空. Thermal Via导热孔. Thermal Zone感热区.
Thermocompression Bonding热压结合. Thermocouple热电偶. Thermode发热体.
Thermode Soldering热模焊接法.
Thermogravimetric Analysis, (TGA)热重分析法. Thermomechanical Analysis (TMA)热机分析法. Thermoplastic热塑性. Thermosetting热固性.
Thermosonic Bonding热超音波结合. Thermount聚醯胺短纤席材. Thermo-Via导热孔. Thick Film Circuit厚膜电路.
Thief辅助阳极. Thin Copper Foil薄铜箔. Thin Core薄基板.
Thin Film Technology薄膜技术.
Thin Small Outline Package(TSOP)薄小型绩体电路器. Thinner调薄剂.
Thixotropy抗垂流性,摇变性. Three Point Bending三点压弯试验. Three-Layer Carrier三层式载体. Threshold Limit Value (TLV)极限值. Through Hole Mounting通孔插装. Through Put物流量,物料通过量. Throwing Power分布力. Tie Bar分流条. Tin Drift锡量漂飘失. Tin Immersion浸镀锡.
Tin Pest锡疫(常见白色金属锡为\锡\当温度低于13.2℃ 时则β锡将逐渐转变成粉末状灰色\锡\称为\锡疫\Tin Whishers锡须. Tinning热沾焊锡. Tolerance公差. Tombstoning墓碑效应. Tooling Feature工具标示物. Topography表面地形. Torsion Strength抗扭强度. Touch Up触修,简修. Trace 线路,导线.
Traceability追溯性,可溯性. Transducer转能器. Transfer Bump移用式突块.
Transfer Laminatied Circuit转压式线路. Transfer Soldering移焊法. Transistor晶体管. Translucency半透性. Transmission Line传输线. Transmittance透光率. Treament, Treating含浸处理. Treeing枝状镀物,镀须. Trim修整, 精修. Trim Line裁切线. Trimming修整,修边. True Position真位. Tungsten钨
Tungsten Carbide碳化钨.