Title Preparation and properties of polyimide/inorganic filler thermally conductive composites Abstract Polyimide is well known as functional polymer materials with heat resistance, mechanical properties and low dielectric. Boron nitride (BN) is a kind of ceramic filler, which is widely used in science and technology, displaying very high thermal conductivity while keeping electrically insulation. Besides, BN could also remain dielectric when the thermal conductivity is high. For PI/BN composites, the surface of BN were tried to make KH-560 graft chemically to improve the compatibility between the matrix and the filler, which can reduce the heat transfer resistance between them. The surface treatment and the effects of fillers content on the thermal conductivity, electric insulation performance, mechanical properties and thermal stability of the composites were discussed in detail by many modern characterizing methods. KH-560 has been successfully grafted to the surface of BN particles. With a rise in the BN contents, the thermal conductivity of the PI/BN composites increased. As a result, the thermal conductivity of modified PI/BN composites is higher than that of PI/original BN. With the increase of BN content, the composites could remain good electrical insulation
while the tensile strength showed a downward trend. Keywords: polyimide composite film boron nitride thermal conductivity thermally conductive mechanism
目 录
1 绪论 ...............................................................................................................................
1.1 研究背景 ...........................................................................................................
1.2 导热绝缘高分子材料研究现状 .......................................................................
1.2.1 本征型高分子材料的研究进展 .............................................................
1.2.2 填充型高分子材料的研究进展 .............................................................
1.2.3 聚合物基体的选择 .................................................................................
1.2.4 聚酰亚胺的合成路线 .............................................................................
1.3 导热机理 ...........................................................................................................
1.4 本文研究目的及主要内容 ...............................................................................
2 实验部分 .....................................................................................................................
2.1 实验药品及所用仪器 .......................................................................................
2.1.1 实验所需药品及处理方法 .....................................................................
2.1.2 实验所用设备及仪器 .............................................................................
2.2 实验过程 ...........................................................................................................
2.2.1 氮化硼的表面处理 .................................................................................
2.2.2 PI/BN复合薄膜的制备 .........................................................................
2.3 性能表征 ...........................................................................................................
2.3.1 傅里叶变换红外光谱分析 .....................................................................
2.3.2 导热系数测试 .........................................................................................
2.3.3 热失重分析 .............................................................................................
2.3.4 电绝缘性测试 .........................................................................................
2.3.5 力学性能测试 .........................................................................................
2.3.6 X射线光谱仪 .........................................................................................
2.3.7 微观形貌的测定 .....................................................................................
3 结果与讨论 .................................................................................................................
3.1 氮化硼组成及微观分析 ...................................................................................
3.1.1 h-BN的元素组成分析 ...........................................................................
3.1.2 氮化硼的微观形貌 .................................................................................
3.2 氮化硼的表面改性 ...........................................................................................
3.2.1 傅里叶变换红外光谱分析 .....................................................................
3.2.2 热失重分析 .............................................................................................
3.3 PI/BN复合薄膜的性能表征 ...........................................................................
3.3.1 聚酰亚胺薄膜的红外谱图分析 .............................................................
3.3.2 纯PI及PI/BN复合薄膜的导热性能 ..................................................
3.3.3 聚酰亚胺薄膜的热失重分析 .................................................................
3.3.4 复合材料的电绝缘性能表征 .................................................................
3.3.5 PI/BN复合薄膜的拉伸性能表征 .........................................................
3.3.6 PI/BN复合材料的微观形貌 .................................................................
结 论 ...............................................................................................................................
参 考 文 献 .....................................................................................................................
致 谢 ...............................................................................................................................