ASUSTeK COMPUTER INC.
Revision Built Date Writer
1.80 06/16/05 PEs
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Table of Contents
Revision History ............................................................................... 3 Description ....................................................................................... 6 1. 新產品導入 .................................................................................... 7
1.1 1.2 1.3
新產品導入流程 ....................................................................................... 7 產品命名原則 ........................................................................................... 9 Golden Sample BOM Check要點 .......................................................... 9
2. ECN/R & BIOS Release ............................................................. 10
2.1 ECN/ECR導入流程 ............................................................................... 10 2.2 ECN/ECR 查詢及Sign in ..................................................................... 11 2.3 ECN/ECR Release注意事項 ................................................................ 14 2.4 BIOS CHECK LIST ............................................................................... 14 2.5 新機種PR…………………………………………………………………………… .15
3. 異常處理 ..................................................................................... 17
3.1 3.2 4.1 4.2 4.3 4.4 4.5 4.6 5.1 5.2 5.3 5.4 5.5 6.1 6.2 7.1 7.2 7.3 8.1 8.2
異常處理流程 ......................................................................................... 17 不良品分析與記錄.................................................................................. 18 零件異常處理流程.................................................................................. 20 零件異常說明 ......................................................................................... 21 零件品質異常禁用設定作業................................................................... 21 零件量試 ................................................................................................ 23 零件送分析流程 ..................................................................................... 24 RMA、DOA不良零件處理流程 ............................................................ 28 CAR目的 ............................................................................................... 29 OQC異常處理流程................................................................................ 29 原因分析 ................................................................................................ 29 重工方式 ................................................................................................ 30 預防對策 ................................................................................................ 30 BOM查詢 .............................................................................................. 31 BOM維護 .............................................................................................. 33 SOP撰寫 ............................................................................................... 34 作業指導書編碼原則 .............................................................................. 34 作業指導書封面架構 .............................................................................. 35 目的 ........................................................................................................ 36 資料查詢、收集 ..................................................................................... 36
4. 零件 (Components)................................................................... 20
5. C.A.R (Corrective Action Report) ............................................ 29
6. BOM (Bill Of Material) ............................................................... 31 7. SOP (Standard Of Procedure) .................................................. 34
8. 測詴良率 ..................................................................................... 36
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8.3 報表製作 ................................................................................................ 36
9. TEST Programs ......................................................................... 37
9.1 測試程式目的 ......................................................................................... 37
9.2 測試程式維護 ......................................................................................... 37 9.3 測試程式編碼原則.................................................................................. 37 9.4 產線的維護….………………………………………………………….… 38 9.5 新版測試程式Release流程 .................................................................. 38 9.6 程式變更後通知流程 .............................................................................. 38
10. TEST SERVER .......................................................................... 39
10.1 10.2 10.3
介紹 ........................................................................................................ 39 SERVER異常處理流程......................................................................... 39 SERVER 測試程式架構 ........................................................................ 39
11. 其他作業 .................................................................................... 40
11.1 Web Flow指示連絡報單作業 ................................................................ 40
11.2 維修能力的提昇……………………………………………………………………..43
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Revision History Rev. Date 1.10 1.20 12/20/2000 Description of Change Reviser Yale Yale 1.30 1.40 First Release 12/28/2000 *刪除11.記錄表單之e.網路號碼表. 該表已轉由DIP加工室控管. *修改3.1.異常處理流程 01/04/2001 *Update7.2作業指導書編碼原則. *刪除11.記錄表單之i.OP_Issue及k.2_Pass. 03/05/2001 *將Revision History移至Contents之後. *增加Description來說明寫此SOP的目的及教導新人時,該如何使用此SOP. *增加9.3. TIPTOP網號管理作業 Yale Yale 1.41 03/26/2001 *版本之編碼,改由小數兩碼 *修改1.1新產品導入流程 *增加1.2產品命名原則之代碼說明 *增加2.1 ECN/ECR導入流程之ECN/R內容驗證說明 04/14/2001 *修改9.1測詴程式的目的之b. Function *插入其它作業大標題於記錄表單之前,且依序標號為11及12 *將TIPTOP網號管理作業,由標題9.3.改為11.1. *增加9.3測詴程式編碼原則 *修改4.2零件異常說明 *修改8.測詴良率的做法 *增加12記錄表單之m.Trend Chart.XLS Yale 1.42 Yale 1.43 05/04/2001 *修改9.3測詴程式編碼原則 *增加9.4測詴主批次檔架構 *增加7-3作業指導書封面架構 05/19/2001 *修改SOP之架構-將Description移至本Form之後 *定義PE各職務應有的技能與工作(Description) *修改3.1異常處理流程之異常處理時效 *增加10.5 SERVER時間校正 *增加11.1 TIPTOP網號管理作業內容 *增加11.2內部會議 *增加各作業與12.記錄表單的連結 *增加3.2各站不良分析與記錄 *增加3.3燒板處理作業 06/04/2001 *增加9.5新版測詴程式Release流程 *增加記錄表單n.Program List Yale 1.50 Yale 1.51 Jong --------------------------------------------------------------------------------------------------------------------------- Product Engineer (PE) SOP Page: 3 /43
Rev 1.80 ---------------------------------------------------------------------------------------------------------------------------- Yale 1.52 06/11/2001 *修改4.2零件異常說明,將零件送分析流程獨立至4-5. *增加4.5零件送分析流程 *增加4.6 RMA、DOA不良零件處理流程 *增加1.2產品命名原則之代碼說明 1.53 06/14/2001 *增加8.4 RMA、DOA維修資料查詢、收集 *增加4.4零件量詴之驗證項目表 *取消記錄表單之i.Relay. *修改記錄表單之k. Component Surveillance List及l.Component Analysis Report作業方式 1.54 07/04/2001 *增加1.2產品命名原則之代碼說明 *增加11.3 WebFlow指示連絡報單作業 *增加11.1 TIPTOP網號管理的區間號碼資料 07/24/2001 *變更標題型式(Including Revision History Table) 07/28/2001 *修改10.1 LC測詴網路架構圖 09/06/2001 *增加Golden Sample 吊卡圖例於1.3 Golden Sample BOM Check要點 11/22/2001 *修改11.1 TIPTOP網號管理的區間為附件,起始版本為3 12/12/2001 *修改字型由Times New Roman為Arial *修改2.5 BIOS命名原則,針對OEM BIOS部份 *增加2.6 PCBA/BIOS相關ECN申請維護作業 *修改4.4 零件量詴,針對OEM VGA Card量詴,頇額外附上Yiled Rate Report *修改9. TEST PROGRAMS,刪除Sampling相關作業 *修改11.1 TIPTOP網號管理作業 1.60 12/26/2001 *增加ECN/R的Sign in,故修改2.2為ECN/ECR 查詢及Sign in. *修改2.4 BIOS Release,頇針對每一BIOS做記錄,於j.Golden Sample & BIOS List *修改7.2作業指導書編碼原則. *修改9.5新版測詴程式Release流程. *增加假日輪值,故修改11.2 為內部會議及假日輪值. *增加零件禁用及量詴範例,於11.3 Web Flow指示連絡1.61 1.62 報單作業. 01/03/2002 *新增11.4派外支援,代理人交接注意事項. 01/14/2002 *新增8.5 Testing Time Reduce Evaluation Procedure Yale Joe Yale Yale Yale 1.55 1.56 1.57 1.58 1.59 Yale Yale Joe Yale Yale --------------------------------------------------------------------------------------------------------------------------- Product Engineer (PE) SOP Page: 4 /43